LS1024ASN7JLA

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LS1024ASN7JLA

+Nomenclature

LS1024 - QORIQ LAYERSCAPE 32-BIT

  • FabricantFreescale semiconducteurs

  • Pièce fabricant #LS1024ASN7JLA

  • Package FBGA-625

  • En stock4483

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Présentation

Description

The LS1024ASN7JLA is a high-performance networking processor from NXP Semiconductors, part of the Layerscape family. It features a dual-core ARM Cortex-A72 architecture, optimized for embedded networking and industrial applications. Key specifications include:
- Cores: Dual 64-bit ARM Cortex-A72 @ up to 1.6 GHz
- Memory: Supports DDR4 with ECC, up to 16 GB
- Networking: Integrated packet processing acceleration, 10G/1G Ethernet support
- Security: Hardware encryption (SEC 5.4), secure boot, and trusted execution
- I/O: PCIe Gen3, SATA 3.0, USB 3.0, and GPIO interfaces
Designed for gateways, routers, and edge computing, it balances power efficiency with high throughput. Its QorIQ-based architecture ensures reliability for critical infrastructure.
For detailed specs, refer to NXP’s official datasheet.

Equivalent

The LS1024ASN7JLA is a networking processor from NXP's Layerscape family. Equivalent or similar products include:
- NXP LS1024A: Same series, different variants.
- NXP LS1028A: Higher performance, similar architecture.
- NXP LS1043A/LS1046A: Quad-core alternatives.
- Marvell Armada 3720/8040: Competing networking SoCs.
- Intel Atom C3000: x86-based alternative.
Check datasheets for exact compatibility based on your requirements.

Features

The LS1024ASN7JLA is a high-performance networking processor from NXP's Layerscape family. Key features include:
- Dual 64-bit ARM Cortex-A72 cores @ up to 1.6 GHz
- Integrated packet processing acceleration (DPAA2) for efficient networking
- Supports 10GbE and 1GbE interfaces (up to 4x 10GbE ports)
- DDR4 memory controller (up to 2133 MT/s)
- PCIe Gen3 (x4, x2, x1 lanes) and SATA 3.0 support
- Security engine (SEC 5.4) for hardware-accelerated encryption (AES, SHA, etc.)
- Low power consumption (~10W typical)
- Industrial temp range (-40°C to +105°C)
Ideal for networking, industrial, and embedded applications requiring high throughput and energy efficiency.

Pinout

The LS1024ASN7JLA is a NXP QorIQ LS1024A processor, featuring:
- Pin Count: 780-ball (19x19 mm) FC-PBGA package.
- Key Functions:
- Dual 64-bit ARM Cortex-A72 cores @ up to 1.6 GHz.
- Integrated DDR4/LPDDR4 memory controller.
- PCIe Gen3, SATA 3.0, USB 3.0, Gigabit Ethernet interfaces.
- Hardware acceleration for security (SEC 5.0), packet processing (DPAA2).
- Target applications: networking, industrial, embedded systems.
For full details, refer to the NXP datasheet.

Manufacturer

The LS1024ASN7JLA is a networking processor manufactured by NXP Semiconductors, a global leader in embedded processing solutions. NXP specializes in automotive, industrial, IoT, and communication infrastructure products, known for high-performance, secure, and energy-efficient semiconductor solutions. The LS1024A is part of NXP's Layerscape family, designed for networking applications like routers, switches, and gateways. NXP was formerly part of Philips before becoming independent and merging with Freescale in 2015.

Application

The LS1024ASN7JLA, a member of NXP's Layerscape family, is a high-performance, low-power processor designed for networking and embedded applications. Key application areas include:
- Networking Equipment: Routers, switches, and gateways.
- Industrial Automation: Control systems and edge computing.
- Telecommunications: 5G infrastructure and base stations.
- Embedded Systems: IoT gateways and smart devices.
- Automotive: Connected vehicle systems and V2X communication.
Its multicore ARM architecture, security features, and energy efficiency make it suitable for demanding, scalable solutions.

Package

The LS1024ASN7JLA is a System-in-Package (SiP) that integrates a Power Architecture-based processor with DDR4 memory and other components. It comes in a 783-pin, 29×29 mm flip-chip ball grid array (FCBGA) package, designed for high-performance networking and embedded applications. The package ensures compact integration and thermal efficiency.

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