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IC OPAMP VFB 1 CIRCUIT SOT23-6
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FabricantTexas Instruments
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Pièce fabricant #LMH6639MF
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Package SOT-23-6
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En stock7096
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Spécifications
| Attribut | Valeur |
| Supplier | Texas Instruments,Rochester Electronics, LLC |
| Package / Case | Tape & Reel (TR),Cut Tape (CT),Bulk |
| Series | VIP10™ |
| Part Status | Not For New Designs |
| Amplifier Type | Voltage Feedback |
| Number of Circuits | 1 |
| Output Type | Rail-to-Rail |
| Slew Rate | 200V/µs |
| Gain Bandwidth Product | 90 MHz |
| -3 dB Bandwidth | 228 MHz |
| Current - Input Bias | 1.4 µA |
| Voltage - Input Offset | 1.3 mV |
| Supply Current | 4.18mA |
| Current - Output / Channel | 112 mA |
| Voltage - Supply Span(Min) | 3 V |
| Voltage - Supply Span(Max) | 12 V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
Présentation
Description
Key points:
- High bandwidth and fast slew rate for sharp edges
- Low noise and good distortion performance
- Wide supply ranges with robust thermal behavior (exact values in the datasheet)
- Compact MSOP-VSSOP-8 package (MF suffix indicates RoHS-compliant packaging)
Typical uses:
- ADC driver front-ends
- Video and RF signal conditioning
- Transimpedance or general high-speed amplification in instrumentation
Note: Check the datasheet for exact electrical specifications (gain, bandwidth, slew rate, input bias, output swing, and supply voltage ranges) and the recommended operating conditions.
Equivalent
Pinout
Function: Dual high-speed operational amplifier (voltage-feedback) for wideband signal amplification.
Manufacturer
- About the company: TI is an American multinational semiconductor company that designs, manufactures, and sells analog and embedded processing integrated circuits. It is headquartered in Dallas, Texas, and is one of the world’s largest IC producers.
Application
- RF/IF front-end signal conditioning
- High-speed video, imaging, and data-conversion front-ends
- Photodiode/transimpedance amplifier for optical receivers
- Sensor interfaces in instrumentation and test equipment
- Communications receivers and wireless transceivers
- DAC/ADC driver and other high-speed signal-conditioning tasks
(Compact packaging options like MSOP/DFN are common.)