KLMCG2UCTB-B041

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KLMCG2UCTB-B041

+Nomenclature

64GB Memory (ICs) RoHS

  • FabricantSamsung

  • Pièce fabricant #KLMCG2UCTB-B041

  • En stock10900

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Spécifications

Attribut Valeur
MemorySize 64GB
NANDOperatingVoltage(VCCF) 1.8V;3.3V
Operatingtemperature -25℃~+85℃

Présentation

Equivalent

The KLMCG2UCTB-B041 is a Samsung eMMC chip. Equivalent products include:
- Samsung KLMCG2JETD-B041 (similar eMMC 5.1, varying capacities)
- Micron MTFC4GACAJCN-4M (4GB eMMC 5.1)
- SK Hynix H26M31001HPR (4GB eMMC 5.0)
- Toshiba THGBM4G4D1HBAIR (4GB eMMC 5.0)
Check datasheets for exact compatibility, as pinouts and specs may vary slightly.

Manufacturer

The KLMCG2UCTB-B041 is manufactured by SK hynix, a South Korean company specializing in semiconductor production. SK hynix is a global leader in memory chips, including DRAM, NAND flash, and SSD solutions, serving industries like computing, mobile, and data storage. The company is part of the SK Group, one of South Korea's largest conglomerates.

Application

The KLMCG2UCTB-B041 is a high-performance connector commonly used in:
1. Automotive Electronics – For sensors, infotainment, and power systems.
2. Industrial Equipment – In automation, robotics, and control systems.
3. Consumer Electronics – For compact, reliable connections in devices.
4. Telecommunications – Supporting signal transmission in networking hardware.
5. Medical Devices – Ensuring secure connections in diagnostic and monitoring equipment.
Its durability and precision make it suitable for harsh environments and high-reliability applications.

Package

The KLMCG2UCTB-B041 is a BGA (Ball Grid Array) package. It features a compact, surface-mount design with solder balls on the underside for electrical connections, commonly used in high-density integrated circuits. Exact dimensions and ball count may vary, so refer to the datasheet for specifics.

Frequently Asked Questions


Q: What are the operating voltage requirements for the KLMCG2UCTB-B041?
A: The NAND array requires 1.8V and 3.3V supply voltages (VCCF), supporting common memory interface standards.


Q: Is this eMMC component suitable for industrial temperature ranges?
A: Yes, it supports an operating temperature of -25°C to +85°C, making it reliable for industrial and embedded environments.


Q: What is the total storage capacity of the KLMCG2UCTB-B041?
A: It provides 64GB of embedded NAND flash memory, suitable for high-density data storage in mobile or IoT devices.


Q: Can this component handle both 1.8V and 3.3V logic simultaneously?
A: Yes, it supports dual VCCF options (1.8V/3.3V), allowing flexible integration with different host controller designs.


Q: What typical applications is this memory solution designed for?
A: It is ideal for smartphones, tablets, industrial storage, and automotive infotainment requiring reliable, high-capacity flash memory.


Q: Does the temperature range affect long-term data retention?
A: At -25°C to +85°C, the component meets standard NAND retention specifications, though extreme thermal cycling may reduce endurance.


Q: Is the KLMCG2UCTB-B041 a single-die or multi-die package?
A: Based on the 64GB density and Samsung's typical architecture, it likely integrates multiple NAND dies in a single BGA package.


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