K4B4G1646E-BCK0

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K4B4G1646E-BCK0

+Nomenclature

  • FabricantMoteur Samsung

  • Pièce fabricant #K4B4G1646E-BCK0

  • En stock12142

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Spécifications

Attribut Valeur
Manufacturer Samsung Electro-Mechanics
Package / Case FBGA-96(7.5x13)

Présentation

Description

The K4B4G1646E-BCK0 is a type of DRAM memory chip produced by Samsung. Specifically, it is a DDR3 SDRAM, which stands for Double Data Rate 3 Synchronous Dynamic Random-Access Memory. This chip is designed for high-speed data processing and is commonly used in computers and other electronic devices that require fast memory access. The "4G" in the model number indicates that it has a memory capacity of 4 gigabits, while the "16" suggests it has a data width of 16 bits.
The chip operates at a voltage of 1.5V, improving energy efficiency, and supports various clock speeds to accommodate different performance needs. DDR3 technology allows for faster data rates compared to its predecessors, making it suitable for applications that require enhanced bandwidth, like gaming, multimedia editing, and server operations. The BCK0 suffix indicates specific packaging or performance characteristics defined by Samsung. Overall, the K4B4G1646E-BCK0 is a reliable component for systems requiring efficient and rapid memory operations.

Equivalent

The K4B4G1646E-BCK0 is a 4Gb DDR3 DRAM chip from Samsung. Equivalent products include the following DDR3 DRAM chips from other manufacturers:
1. Hynix H5TQ4G63AFR series.
2. Micron MT41K256M16 series.
3. SK Hynix H5TQ4G83MFR series.
4. Nanya NT5CB256M16 series.
These products generally offer similar specifications and performance characteristics, but always verify compatibility with specific system requirements.

Features

The K4B4G1646E-BCK0 is a DRAM module, specifically a 4Gb DDR3L SDRAM, manufactured by Samsung. Here are its key features:
1. Density and Organization: 4Gb (Gigabit) with an organization of 256M x 16.

2. Technology: DDR3L, which stands for Double Data Rate 3 Low Voltage, operating at 1.35V, but also compatible with standard DDR3 voltage of 1.5V.
3. Data Rate: Capable of data rates up to 1600Mbps.
4. Package: Available in a compact 96-ball FBGA (Fine-pitch Ball Grid Array) package.
5. Speed: Supports JEDEC specifications for DDR3-1600, DDR3-1333, DDR3-1066, and DDR3-800.
6. Burst Length: Configurable burst lengths of 8 or 4 with burst chop.
7. On-Die Termination (ODT): Provides options for termination resistance for improved signal integrity.
8. Power Efficiency: Enhanced power efficiency due to its low voltage operation, making it suitable for mobile and compact applications.
9. Temperature Range: Supports a standard operating temperature range, making it versatile for various applications.
This DRAM is commonly used in consumer electronics, computers, and other devices requiring efficient memory solutions.

Pinout

The K4B4G1646E-BCK0 is a DDR3 SDRAM memory chip manufactured by Samsung. It typically comes in a 78-ball FBGA (Fine-Pitch Ball Grid Array) package. This type of SDRAM is used primarily in high-performance computing applications, including PCs, laptops, and other electronic devices requiring efficient memory solutions.
The primary functions of the K4B4G1646E-BCK0 include:
1. Data Storage: It provides 4 gigabits (Gb) of storage capacity, allowing for temporary storage of data for quick access by the system's processor.
2. High-Speed Data Transfer: DDR3 technology enables high-speed data transfer rates, which can significantly improve system performance over older DDR2 technology.
3. Power Efficiency: DDR3 is known for its reduced power consumption compared to its predecessors, making it suitable for mobile and energy-sensitive applications.
4. Error Correction Option: It supports optional error correction code (ECC) to enhance data reliability, especially in mission-critical applications.
The function and pin configuration can vary slightly based on the specific requirements of the system where it is implemented, but this provides a general overview of its capabilities and structure.

Manufacturer

The K4B4G1646E-BCK0 is a DRAM memory chip manufactured by Samsung Electronics. Samsung Electronics is a multinational conglomerate headquartered in South Korea. It is one of the largest technology companies globally, known for producing a wide range of electronic components and consumer electronics. The company operates in several key areas, including semiconductors, consumer electronics such as smartphones and televisions, and other technology-related services. Samsung is recognized for its significant role in the semiconductor industry, producing various types of memory products, including DRAM, NAND flash, and SSDs, making it a crucial supplier for numerous tech companies worldwide.

Application

The K4B4G1646E-BCK0 is a DRAM memory chip, specifically a 4Gb DDR3 SDRAM, commonly used in various electronic applications. Its primary application areas include:
1. Computing Devices: Used in desktops, laptops, and servers for main memory to enhance performance and multitasking capabilities.

2. Consumer Electronics: Found in smart TVs, gaming consoles, and digital cameras for improved memory capacity and speed.
3. Networking Equipment: Utilized in routers and switches for efficient data processing and traffic management.
4. Mobile Devices: Employed in older smartphones and tablets for memory functions, although newer devices typically use DDR4 or DDR5.
These applications leverage the chip's ability to provide reliable and fast data access and storage.

Package

The K4B4G1646E-BCK0 is a DRAM chip manufactured by Samsung. It typically comes in a Fine-Pitch Ball Grid Array (FBGA) package, which is common for memory devices, allowing for high-density mounting on printed circuit boards.

Frequently Asked Questions


Q: What is the memory type and organization of the K4B4G1646E-BCK0?
A: It is a 4Gb DDR3 SDRAM organized as 256M x16, suitable for high-bandwidth memory applications.


Q: What package does this Samsung component use?
A: It uses a standard FBGA-96 package with dimensions of 7.5mm x 13mm, ideal for space-constrained designs.


Q: What is the primary application for the K4B4G1646E-BCK0?
A: It is designed for use in servers, networking, and high-performance computing systems requiring DDR3 memory.


Q: Does this part support industrial temperature ranges?
A: Based on the given parameters, the temperature grade is not specified; verify the suffix “BCK0” for commercial or industrial range.


Q: Can the K4B4G1646E-BCK0 replace other 4Gb DDR3 parts?
A: Yes, if the package (FBGA-96) and speed grade are compatible, it can serve as a drop-in replacement for similar 256Mx16 DDR3 devices.


Q: What is the typical data rate for this DDR3 component?
A: The exact speed grade is not provided, but standard DDR3 operates from 800 to 2133 Mbps per pin.


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