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K4B4G1646D-BCK0
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FabricantSamsung Electronics
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Pièce fabricant #K4B4G1646D-BCK0
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Fiche technique K4B4G1646D-BCK0 DataSheet
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En stock11626
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Spécifications
| Attribut | Valeur |
| EU Ro HS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8542.32.00.36 |
| Automotive | No |
| PPAP | No |
| Chip Density (bit) | 4G |
| Number of Bits / Word (bit) | 16 |
| Interface Type | SSTL_1.5 |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| Operating Current (m A) | 118 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Mounting Type | Surface Mount |
| Package Width | 7.5 |
| Package Length | 13.3 |
| PCB changed | 90 |
| Package / Case | BGA |
| Supplier Device Package | FBGA |
| Pin Count | 90 |
| Lead Shape | Ball |
| DRAM Type | DDR3 SDRAM |
| Organization | 256Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 32M |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (M Hz) | 1600 |
| Maximum Access Time (ns) | 0.225 |
| Address Bus Width (bit) | 18 |
| Number of I / O Lines (bit) | 16 |
| Supplier Temperature Grade | Commercial |
Présentation
Description
To understand this module:
1. Type and Capacity: It could be part of DDR series (e.g., DDR3, DDR4) with specific gigabit or gigabyte capacity.
2. Speed and Voltage: Speed may be indicated in megatransfers per second (MT/s), and the operating voltage could be crucial for compatibility.
3. Use Case: Typically used in PCs, servers, or mobile devices, depending on its specifications.
4. Package and Form Factor: Information on dimensions and packaging type (e.g., FBGA) is important for physical compatibility.
For precise specifications, consulting the manufacturer's datasheet or official product documentation is essential. This ensures compatibility and optimal performance in intended applications.
Equivalent
1. H5TC4G63AFR from SK Hynix
2. MT41K256M16 from Micron Technology
3. W631GG6KB from Winbond
4. EDE5116AJBG from Elpida (now part of Micron)
These chips are typically similar in terms of capacity, voltage, and performance specifications. Always verify compatibility with the specific requirements of your application.
Features
1. Capacity: 4Gb (Gigabit), which is equivalent to 512MB (Megabytes).
2. Type: DDR3 (Double Data Rate 3) SDRAM, offering higher bandwidth compared to its predecessors.
3. Speed: Typically operates at data rates of 1600 MT/s (megatransfers per second).
4. Voltage: Designed to operate at 1.5V, contributing to energy efficiency.
5. Package: Available in FBGA (Fine Ball Grid Array) package, which assists in efficient heat dissipation and space-saving on circuit boards.
6. Applications: Used in a variety of computing applications, including PCs, laptops, and servers, due to its balance of speed and power efficiency.
7. Reliability: Features error correction and robust design for consistent performance.
These features make it suitable for both consumer and professional computing environments where reliable memory performance is essential.
Pinout
The main functions of this DDR3 DRAM include:
1. Memory Storage: It provides 4 gigabits of storage capacity.
2. High-Speed Data Transfer: Supports data rates of up to 1600 MT/s (megatransfers per second).
3. Low Power Consumption: Operates efficiently, suitable for mobile and desktop applications.
4. JEDEC Standard Compliance: Ensures compatibility with other JEDEC-standard DDR3 interfaces.
5. Self-Refresh and Power-Down Modes: Helps conserve power when the memory is not actively in use.
These functionalities make it suitable for use in a wide range of devices requiring efficient and high-speed memory solutions.
Manufacturer
Samsung Electronics is renowned for its innovative products and technological advancements. It is a leading global manufacturer of semiconductors, particularly memory chips like DRAM and NAND flash, which are critical components in a wide range of electronic devices, from computers and smartphones to servers and other data storage systems. The company is also known for its smartphones, televisions, and other consumer electronics products. Samsung's significant investment in research and development has helped it maintain a competitive edge in the rapidly evolving tech industry.
Application
1. Consumer Electronics: Used in devices like smart TVs, gaming consoles, and set-top boxes for efficient memory management.
2. Computing: Integrated into laptops, desktops, and servers to enhance memory performance and multitasking capabilities.
3. Networking Equipment: Employed in routers and switches to manage data efficiently.
4. Embedded Systems: Utilized in industrial and automotive systems requiring reliable memory solutions.
These applications benefit from the chip's high-speed data processing capabilities and energy efficiency.
Package
Frequently Asked Questions
Q: What is the memory density and organization of this DDR3 SDRAM?
A: It has a total density of 4Gb, organized as 256M words by 16 bits per word (256Mx16).
Q: What is the maximum supported clock rate and access time?
A: The maximum clock rate is 1600 MHz, with a maximum access time of 0.225 ns.
Q: What is the supply voltage range for this component?
A: The minimum operating voltage is 1.425V and the maximum is 1.575V, compliant with DDR3 SSTL_1.5 standards.
Q: What is the operating temperature range for this DRAM?
A: It is rated for commercial temperature operation from 0°C to 95°C.
Q: How many internal banks and I/O lines does it feature?
A: It contains 8 internal banks with 16 I/O lines (data bus width of 16 bits).
Q: Is this component suitable for automotive or PPAP applications?
A: No, it is not automotive qualified and does not support PPAP; it is for commercial use.
Q: What is the package type and pin count of this part?
A: It uses a 90-ball FBGA package with a standard BGA name, measuring 13.3mm x 7.5mm.