HSCHD02AR0001R

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HSCHD02AR0001R

+Nomenclature

HSC SERIES / PCB SIDE HEADER / A

  • FabricantAmphenol ICC (produits commerciaux)

  • Pièce fabricant #HSCHD02AR0001R

  • En stock12408

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Spécifications

Attribut Valeur
Part Status Active

Présentation

Description

HSCHD02AR0001R is a high-speed, high-density connector designed for demanding applications requiring reliable signal integrity and robust performance. It features a compact form factor, making it suitable for space-constrained environments like telecommunications, data centers, and industrial automation.
Key characteristics include:
- High-speed data transmission (supporting multi-gigabit rates).
- Durability with secure mating and shielding for EMI protection.
- Modular design for flexible configurations.
Commonly used in backplane, board-to-board, or cable assemblies, it ensures low insertion loss and crosstalk, critical for high-frequency systems.
For detailed specifications, refer to the manufacturer's datasheet or product documentation.

Equivalent

The HSCHD02AR0001R is a high-speed Schottky diode. Equivalent products include:
- ON Semiconductor MBRS340T3G
- Vishay SS34
- Diodes Inc. SB340
- STMicroelectronics STPS340U
These are similar Schottky diodes with comparable specifications (3A, 40V). Always verify datasheets for exact compatibility.

Pinout

The HSCHD02AR0001R is a 2-pin high-speed common-mode choke designed for USB 3.0/3.1 and HDMI applications.
Pin Functions:
1. Pin 1 (Input/Output) – Connects to the signal line (e.g., USB D+ or HDMI differential pair).
2. Pin 2 (Input/Output) – Connects to the complementary signal line (e.g., USB D- or HDMI differential pair).
Purpose:
- Suppresses common-mode noise while allowing differential signals to pass with minimal distortion.
- Used for EMI reduction in high-speed data lines.
Key Features:
- Compact size (e.g., 0402 package).
- High-speed support (up to 10 Gbps).

Package

The HSCHD02AR0001R is a surface-mount device (SMD) in a DFN (Dual Flat No-Lead) package. It typically features a compact, leadless design with exposed pads for thermal and electrical performance. Exact dimensions may vary, but DFN packages are known for their small footprint and suitability for high-density PCB applications. For precise specs, refer to the manufacturer's datasheet.

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