HMC264LC3B

HMC264LC3B is a broadband GaAs MMIC RF device from Hittite Microwave (now Analog Devices). It’s intended as a front-end block in RF/microwave systems (used as a gain/LNA or mixer block, depending on circuit design).
Key points:
- Package: LC3B leadless surface-mount MMIC.
- I/O: typically 50-ohm matched ports; external RF matching and bias networks required.
- Biasing: requires a biasing scheme with DC blocks/chokes per the datasheet.
- Applications: compact, integrated RF front ends for communications, radar, test equipment, and similar systems.
Why use it:
- Enables a compact, monolithic RF block with minimal external components when correctly biased and matched.
Notes:
- For exact frequency range, gain, noise figure, IP3, P1dB, supply voltage/current, pinout, and recommended bias/matching networks, consult the official HMC264LC3B datasheet and the Analog Devices/partner evaluation board documentation.

Here are the typical features of the HMC264LC3B:
- GaAs MMIC, double‑balanced mixer
- 50 Ω matched RF, LO, and IF ports
- Wideband/multi‑octave operation for RF/LO/IF
- High port isolation and low LO leakage
- Moderate conversion loss with high IP3
- LO drive compatible with standard signal levels (no external matching required)
- Single-supply operation
- Compact ceramic package (LC3B), surface‑mount
- Industrial temperature range (-40°C to +85°C) and RoHS compliant
Note: For exact frequency range, loss/IP3 specs, and electrical characteristics, please consult the official datasheet.

- Pin count: 8 pins
- Function: GaAs MMIC mixer (double-balanced) in an 8-pin LCC package (3x3 mm) with RF input, LO input, and IF output for RF up/down conversion.

- Manufacturer: Analog Devices, Inc. (AD); the HMC264LC3B is from the Hittite Microwave line, now part of Analog Devices after its 2014 acquisition.
- What kind of company: A multinational American semiconductor company that designs and manufactures analog, mixed-signal, and RF/microwave integrated circuits for communications, aerospace/defense, industrial, and automotive markets.

Applications areas: RF/microwave front-end for wireless communications, radar, satellite and space systems; receivers/transmitters using GaAs MMIC blocks (LNA, mixer, gain stages); LO/mixer chains, up/downconverters, and IF stages; instrumentation and test equipment; automotive radar and industrial wireless.

Leadless Ceramic Chip Carrier (LCC) package, 6-lead, 3×3 mm body.