Images à titre indicatif uniquement
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FabricantSK Hynix
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Pièce fabricant #H5TC4G63CFR-PBA
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En stock14181
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Spécifications
| Attribut | Valeur |
| Manufacturer | SK HYNIX |
| Package / Case | FBGA-96 |
Présentation
Description
- Density: 4Gb (organized as 512M x 8)
- Voltage: 1.35V (DDR3L, compatible with 1.5V)
- Speed: 800–1600 Mbps (PC3L-12800 to PC3L-6400)
- Package: 96-ball FBGA (Fine-pitch Ball Grid Array)
- Refresh: Auto-refresh & self-refresh
- Applications: Embedded systems, networking, IoT, and consumer electronics.
It supports JEDEC-standard DDR3L timings and offers low power consumption, making it suitable for energy-efficient devices. The "-PBA" suffix typically denotes a specific revision or packaging variant.
For exact specs, refer to the SK Hynix datasheet.
Features
- Low Voltage: Operates at 1.35V (DDR3L), compatible with 1.5V.
- Speed: 800–1600 Mbps data rate (DDR3L-800/1066/1333/1600).
- Density: 4Gb (512Mx8) organization.
- Package: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Timings: CAS Latency (CL9–11) depending on speed grade.
- Refresh: 8192 cycles/64ms (self-refresh supported).
- Interface: 8-bit prefetch, SSTL_15/1.35V I/O.
- Applications: Consumer electronics, networking, embedded systems.
Compact, power-efficient, and high-performance for DDR3L applications.
Pinout
- Pin Count: 96-ball FBGA (Fine-pitch Ball Grid Array).
- Key Functions:
- Low-voltage operation (1.35V, compatible with 1.5V DDR3).
- 8-bit prefetch architecture.
- Double data rate (DDR) interface.
- On-die termination (ODT) for signal integrity.
- Auto-refresh & self-refresh modes.
- CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11.
Common applications include consumer electronics, networking, and embedded systems.
Manufacturer
SK Hynix is a major global producer of memory chips, specializing in DRAM, NAND flash, and other semiconductor solutions. It is one of the largest memory suppliers worldwide, competing with companies like Samsung and Micron. The company supplies components for various applications, including consumer electronics, servers, and mobile devices.
The H5TC4G63CFR-PBA is commonly used in computing and embedded systems, offering standard DDR3 performance. SK Hynix is known for its high-quality memory products and innovation in semiconductor technology.
Package
Frequently Asked Questions
Q: What is the specific application scenario for the H5TC4G63CFR-PBA?
A: This is a high-speed DDR4 SDRAM, ideal for servers, networking, and high-performance computing requiring fast data processing and reliability.
Q: Can the H5TC4G63CFR-PBA be used for embedded designs?
A: Yes, the FBGA-96 package is surface-mount compatible, suitable for space-constrained embedded systems, but verify voltage and timing specs from SK Hynix datasheet.
Q: What does the "4G" in the part number represent?
A: "4G" typically indicates a 4Gb (gigabit) density per chip, equivalent to 512MB, common in 1-rank memory modules for balanced capacity and speed.
Q: Is the H5TC4G63CFR-PBA compatible with standard DDR4 controllers?
A: Yes, as a SK Hynix industry-standard DDR4 component, it follows JEDEC specifications, ensuring compatibility with most DDR4 memory controllers.
Q: Does the FBGA-96 package offer thermal advantages?
A: The 96-ball fine-pitch BGA package provides efficient heat dissipation and reduced inductance, supporting stable operation in high-frequency DDR4 applications.
Q: What is the typical data rate and voltage for this DRAM?
A: Based on the "PBA" suffix, it likely supports up to 2133-2400 Mbps data rate with 1.2V VDD, but refer to the official datasheet for exact timing parameters.
Q: Can it be used as a drop-in replacement for other DDR4 parts?
A: Only if the replacement has identical die density, organization, speed grade, and FBGA-96 pinout; always cross-validate with the target system's memory compatibility list.