GD25LB256EYIGR

GD25LB256EYIGR is a 256-Mbit serial NOR flash memory from GigaDevice. It provides non-volatile storage for firmware and data in embedded systems. The device uses a Serial Peripheral Interface (SPI) and supports multiple I/O modes (standard SPI and Quad/ Dual I/O) for higher throughput. It is organized as memory blocks/pages that are erased in sectors/blocks and programmed in pages. Features typically include fast read, power-down/deep power-down, and write protection options. The GR suffix indicates a specific package variant (commonly an 8-pin package) and related options. Typical uses are boot firmware storage, firmware updates, and data logging in microcontroller-based designs. For exact electrical specs (supply voltage, timing, endurance, operating temperature) and package details, refer to the GD25LB256EYIGR datasheet.

Equivalent 256 Mb SPI flash parts from other vendors:
- Winbond W25Q256JV / W25Q256FV
- Macronix MX25L25645G / MX25L25635F
- Micron N25Q256A13ESE
- ISSI IS25LP256D
- Cypress/Spansion S25FL256S
- Etron EN25Q256
Note: verify voltage, timing, and package to ensure exact compatibility.

Here are the key features of GD25LB256EYIGR (256-Mbit serial flash):
- Density: 256 Mbit (32 MBytes) of non-volatile flash
- Supply: 2.7 V to 3.6 V (single‑supply operation)
- Interface: SPI with support for standard SPI, plus Dual I/O and Quad I/O modes (and QPI for higher throughput)
- Speed: Fast read up to 104 MHz in SPI mode; higher throughput in DIO/QIO/QPI modes
- Memory organization: 256-byte pages; 4 KB sectors; 32 KB/64 KB blocks
- Program/Erase: Page program up to 256 bytes; sector/block/chip erase options
- Endurance/Retention: Typical ~100,000 program/erase cycles; data retention ~20 years
- Power management: Deep power-down mode and low active currents
- Protection: Hardware write protection (WP#) and sector/block protection features
- Temperature grade: Industrial range: -40°C to 85°C
- Package: 8-pin package (RoHS-compliant option available)
- Applications: Firmware/boot memory, code storage, and firmware updates in embedded systems
Note: exact timing and mode availability can vary by revision; consult the datasheet for precise specs.

- Pin count: 8 pins (SOIC-8 package).
- Function: GD25LB256EYIGR is a 256-Mbit serial (SPI) flash memory device. It provides non-volatile storage and uses an SPI interface (with optional Dual/Quad I/O modes on some variants). Typical pins include CS, CLK, DI (MOSI), DO (MISO), WP#, HOLD#, VCC, and GND.

Manufacturer: GigaDevice Semiconductor Inc. (GD).
What kind of company: A Chinese fabless semiconductor company that designs and markets memory ICs (NOR/serial flash) and outsources manufacturing to foundries.

GD25LB256EYIGR is a 256‑Mbit SPI flash memory. Typical application areas include:
- Firmware storage and boot memory for microcontrollers/SoCs (XIP capable)
- Code storage in embedded systems and consumer electronics
- Data logging and parameter storage in IoT devices, sensors, wearables
- Automotive and industrial electronics (ECUs, instrumentation) with suitable temp grades
- Networking equipment and edge devices (routers, switches, gateways)
- FPGA/CPLD configuration memory and external storage extension
These uses leverage its high capacity, fast SPI access, and dual/quad I/O options for higher throughput.

8-pin SOP (SOIC) package; RoHS-compliant/lead-free.