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IC HALF BRIDGE DRIVER 55A 39QFN
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FabricantFairchild Semiconductor Inc
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Pièce fabricant #FDMF3172
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En stock9532
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Output Configuration | Half Bridge (2) |
| Applications | General Purpose |
| Interface | Logic, PWM |
| Load Type | Inductive, Capacitive |
| Technology | Power MOSFET |
| Current - Output / Channel | 55A |
| Current - Peak Output | 70A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 16V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Features | Bootstrap Circuit |
| Fault Protection | Current Limiting, Over Temperature |
| Mounting Type | Surface Mount |
| Package / Case | 39-PowerVFQFN |
| Supplier Device Package | 39-PQFN (5x6) |
| Base Product Number | FDMF3172 |
Présentation
Description
For instance, if FDMF3172 pertains to financial data management, the introduction might explore basic principles of data analysis, database management, and financial modeling. It may also cover the tools and techniques used in managing financial data, as well as the application of these tools in real-world scenarios. Students could expect to learn about organizing, analyzing, and interpreting financial data to make informed business decisions.
If this course is part of a specific curriculum, consulting the course syllabus or academic catalog from the relevant institution would provide more targeted information. For precise details, contacting the course instructor or academic advisor is recommended.
Equivalent
1. Infineon’s IR3553
2. ON Semiconductor’s NCP81253
3. Renesas’s ISL99227
4. Texas Instruments' CSD95372BQ5M
When selecting an equivalent, ensure compatibility with your specific application requirements in terms of voltage, current, and package.
Features
1. Integrated Power Components: It combines high-side and low-side MOSFETs, a driver IC, and a bootstrap diode in a single package.
2. Efficiency: Designed to optimize energy efficiency, reducing power loss and improving thermal performance.
3. Fast Switching: Capable of high-frequency operation, which allows for smaller external components and improved transient response.
4. Thermal Performance: Offers excellent thermal characteristics due to optimized packaging, which aids in heat dissipation.
5. Protection Features: Includes safeguards such as under-voltage lockout, over-current protection, and thermal shutdown to enhance reliability and safety.
6. Compact Design: Its integrated nature reduces the board space required and simplifies PCB layout.
These features make the FDMF3172 a suitable choice for compact, high-performance electronic applications where efficiency and space are critical considerations.
Pinout
The FDMF3172 typically has a 6-pin configuration, with the following functions:
1. PWM: This pin receives the PWM signal from the controller to drive the high-side and low-side MOSFETs.
2. BOOT: This pin connects to the bootstrap capacitor, providing the necessary voltage to drive the high-side MOSFET.
3. SW: The switch node pin connects to the inductor and provides the switching waveform.
4. VDD: This pin provides power to the internal driver IC.
5. GND: The ground pin is the reference for the internal driver IC.
6. VCC: This pin is used to supply power to the control logic.
These pins enable the FDMF3172 to efficiently control power delivery in applications requiring compact size and high efficiency, such as CPU and GPU power supplies.