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EP4CE6F17I8LN
+NomenclatureIC FPGA 179 I/O 256FBGA
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FabricantInformations
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Pièce fabricant #EP4CE6F17I8LN
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Package FBGA-256
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En stock2430
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | Cyclone® IV E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 392 |
| NumberofLogicElements/Cells | 6272 |
| TotalRAMBits | 276480 |
| NumberofI/O | 179 |
| Voltage-Supply | 0.97V ~ 1.03V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Présentation
Description
1. Logic Elements: It contains 6,272 logic elements, which are the building blocks for implementing digital circuits.
2. Embedded Memory: The FPGA includes 270 kilobits of embedded memory for efficient data storage and retrieval.
3. I/O Pins: It provides 179 I/O pins, facilitating connectivity with external devices and systems.
4. Performance: Designed to operate at frequencies suitable for a range of applications, balancing speed and power consumption.
5. Low Power: Cyclone IV FPGAs are known for their low static and dynamic power consumption, making them ideal for portable and embedded systems.
6. Package: The F17 in its name refers to its physical package type, which is the FineLine BGA-256 package, aiding in compact and efficient board design.
Overall, the EP4CE6F17I8LN is suitable for applications in consumer electronics, industrial automation, and communications, where cost and power efficiency are critical.
Equivalent
1. Xilinx Spartan-6 series, such as the XC6SLX9.
2. Lattice's iCE40 series, like the iCE40HX8K.
3. Microchip's (formerly Microsemi/Actel) IGLOO2 or SmartFusion2 series.
When selecting an equivalent, ensure matching specifications such as logic elements, I/Os, and package compatibility.
Features
1. Logic Elements (LEs): The device contains 6,272 logic elements, which are the basic building blocks for creating custom digital circuits.
2. Embedded Memory: It includes 276 Kbits of embedded memory for efficient data storage and processing.
3. Phase-Locked Loops (PLLs): The FPGA has two PLLs for clock management and signal conditioning.
4. I/O Pins: The device offers 179 I/O pins, allowing for a wide range of interfacing capabilities with external components.
5. Package: It comes in a 256-pin FBGA (Fine-pitch Ball Grid Array) package, which supports high-density designs.
6. Operating Temperature: The device operates at industrial temperature ranges, suitable for a variety of operating environments.
7. Low Power Consumption: Designed for energy-efficient applications, making it ideal for portable and battery-powered devices.
8. Applications: Suitable for applications in automotive, consumer electronics, industrial, and communications sectors.
These features make the EP4CE6F17I8LN suitable for a wide range of applications requiring customizable digital logic solutions.
Pinout
Manufacturer
Application
1. Telecommunications: Used in network switching and signal processing.
2. Consumer Electronics: Supports devices like HDTVs and set-top boxes for video processing.
3. Industrial Automation: Employed in control systems and robotics for flexible and programmable logic.
4. Automotive: Utilized in infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Supports imaging systems and portable diagnostic equipment.
6. Aerospace and Defense: Used in radar and communication systems.
Its versatility stems from its reconfigurable logic and moderate performance capabilities, making it suitable for a wide range of cost-sensitive applications.