EP4CE15F23I7N

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EP4CE15F23I7N

+Nomenclature

IC FPGA 343 I/O 484FBGA

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  • Pièce fabricant #EP4CE15F23I7N

  • Package FBGA-484

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Spécifications

Attribut Valeur
Package / Case Tray
Series Cyclone® IV E
Part Status Active
Number of LABs/CLBs 963
Number of Logic Elements/Cells 15408
Total RAM Bits 516096
Number of I/O 343
Voltage - Supply 1.15V ~ 1.25V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)

Présentation

Equivalent

The EP4CE15F23I7N is a Cyclone IV FPGA from Intel (formerly Altera). Equivalent alternatives include:
- Lattice ECP5 (e.g., LFE5U-25F-6BG256C)
- Xilinx Spartan-6 (e.g., XC6SLX16-2CSG324C)
- Microsemi (Microchip) IGLOO2 (e.g., M2GL010-FGG484)
These offer similar logic capacity (~15K LEs) and features. For exact replacements, check pin compatibility and power requirements.

Pinout

The EP4CE15F23I7N is an Altera Cyclone IV FPGA in a 256-pin FineLine BGA (FBGA) package.
Key Features:
- Pin Count: 256 pins (including power, ground, and I/O).
- Logic Elements: 15,408.
- I/O Pins: 142 user I/Os (supports LVDS, LVCMOS, and other standards).
- Memory: 504 Kbits embedded memory.
- PLLs: 4 phase-locked loops (PLLs).
- Package: FBGA (17×17 mm).
Functions:
- General-purpose FPGA for digital logic, embedded processing, and signal processing.
- Supports various communication protocols (SPI, I2C, UART).
- Used in industrial, consumer, and automotive applications.

Application

The EP4CE15F23I7N is a Cyclone IV FPGA from Intel (formerly Altera), suitable for various applications:
- Embedded Systems: Custom logic for industrial control, automation.
- Communications: Signal processing, protocol bridging (UART, SPI, I2C).
- Consumer Electronics: Video/image processing, IoT devices.
- Automotive: Sensor interfacing, infotainment systems.
- Education/Prototyping: FPGA development for students/hobbyists.
Its low power, moderate logic capacity (~15K LEs), and cost-effectiveness make it ideal for small to medium complexity designs.

Package

The EP4CE15F23I7N is an FPGA from Intel's Cyclone IV E series. It comes in a FineLine BGA (FBGA) package with the designation F23, indicating a 23x23 mm body size with 484 pins. The package type is FBGA-484, suitable for high-density and high-performance applications. It supports various I/O standards and operates at industrial temperature ranges (-40°C to 100°C).

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