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EP3C80F484I7N
+NomenclatureIC FPGA 295 I/O 484FBGA
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FabricantInformations
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Pièce fabricant #EP3C80F484I7N
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Package FBGA-484
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En stock1780
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | Cyclone® III |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5079 |
| NumberofLogicElements/Cells | 81264 |
| TotalRAMBits | 2810880 |
| NumberofI/O | 295 |
| Voltage-Supply | 1.15V ~ 1.25V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BGA |
Présentation
Description
Key features of the EP3C80F484I7N include a compact 484-pin FineLine BGA package and 80,000 logic elements, providing substantial capacity for complex designs. It offers multiple I/O banks designed for flexible interfacing and compatibility with different voltage levels. The device is built on a low-power, cost-effective 65-nm process technology, making it suitable for power-sensitive and cost-sensitive applications.
The Cyclone III series prioritizes a balance between performance and power efficiency, making it ideal for applications in consumer electronics, automotive, and telecommunications. The EP3C80F484I7N supports advanced digital design tools, thus enabling efficient programming and optimization for specific tasks. It is widely used by engineers and developers seeking customizable, scalable solutions for intricate digital systems.
Equivalent
1. Xilinx Spartan-6 series (e.g., XC6SLX75)
2. Lattice ECP3 series (e.g., LFE3-95E)
3. Microsemi SmartFusion2 series (e.g., M2S090)
These devices provide similar functionality but may differ in power consumption, performance, or additional features, so it's important to check specific requirements for compatibility.
Features
1. Logic Elements: Contains 81,264 logic elements, providing significant capacity for complex designs.
2. Package: Comes in a 484-pin FineLine BGA (Ball Grid Array) package.
3. Embedded Memory: Includes 2,727 Kbits of embedded memory for efficient data management.
4. DSP Blocks: Equipped with DSP blocks for high-speed arithmetic operations, useful in signal processing applications.
5. I/O Pins: Provides 295 user I/O pins, allowing versatile connectivity options.
6. PLL: Features 4 phase-locked loops (PLLs) for clock management and timing optimization.
7. Supply Voltage: Operates at a core voltage of 1.2V with I/O banks supporting various voltage levels for flexibility.
8. Temperature Range: Suitable for industrial applications with a temperature range of -40°C to 100°C.
9. Low Power: Designed for low power consumption, making it ideal for power-sensitive applications.
These features make the EP3C80F484I7N suitable for a variety of applications, including communications, consumer electronics, and industrial systems.
Pinout
The 484 pins include power and ground pins, dedicated clock input pins, configuration pins, and user I/O pins. The user I/O pins can be configured for different voltage standards and functions, supporting a wide range of interfaces and protocols. Additionally, the FPGA is designed for low power consumption and high performance, making it suitable for a broad spectrum of embedded and industrial applications.
Manufacturer
Application
1. Consumer Electronics: Used in devices requiring efficient processing and low power, such as digital cameras and set-top boxes.
2. Telecommunications: Serves in base stations and other communication infrastructure for signal processing.
3. Industrial Automation: Applied in control systems and robotics for real-time processing.
4. Automotive: Used in advanced driver-assistance systems (ADAS) and infotainment systems.
5. Medical Devices: Supports portable medical equipment with its low power and compact design.
6. Data Acquisition: Employed in systems requiring efficient data processing and analysis.