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EP2AGX65DF29I3N
+NomenclatureIC FPGA 364 I/O 780FBGA
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FabricantAltra
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Pièce fabricant #EP2AGX65DF29I3N
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En stock1873
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Spécifications
| Attribut | Valeur |
| Series | Arria II GX |
| PartStatus | Obsolete |
| BaseProductNumber | EP2AGX65 |
| DigiKeyProgrammable | Not Verified |
| NumberofLABs/CLBs | 2530 |
| NumberofLogicElements/Cells | 60214 |
| TotalRAMBits | 5371904 |
| NumberofI/O | 364 |
| Voltage-Supply | 0.87V ~ 0.93V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package | 780-BBGA, FCBGA |
| SupplierDevicePackage | 780-FBGA (29x29) |
| Packaging | Tray |
Présentation
Description
The EP2AGX65DF29I3N is an Arria II GX FPGA from Intel (formerly Altera). It features 65,000 logic elements (LEs), 4.3 Mb of embedded memory, and 288 DSP blocks, making it suitable for mid-range applications requiring high performance and low power.
Key specs:
- 65 nm process technology
- Transceiver support (up to 3.75 Gbps)
- 1.15V core voltage
- FineLine BGA package (29x29 mm, 780 pins)
- Industrial temperature range (-40°C to 100°C)
Applications include communications, video processing, and industrial automation. Its balance of power efficiency, speed, and logic density makes it a versatile choice for embedded systems.
For detailed specs, refer to Intel’s Arria II GX Device Handbook.
Key specs:
- 65 nm process technology
- Transceiver support (up to 3.75 Gbps)
- 1.15V core voltage
- FineLine BGA package (29x29 mm, 780 pins)
- Industrial temperature range (-40°C to 100°C)
Applications include communications, video processing, and industrial automation. Its balance of power efficiency, speed, and logic density makes it a versatile choice for embedded systems.
For detailed specs, refer to Intel’s Arria II GX Device Handbook.
Equivalent
The EP2AGX65DF29I3N is an Arria II GX FPGA from Intel (formerly Altera). Equivalent alternatives include:
- Xilinx: Kintex-7 (e.g., XC7K70T) or Artix-7 (e.g., XC7A50T)
- Lattice Semiconductor: ECP5 (e.g., LFE5UM-45F)
- Microchip (Microsemi): SmartFusion2 (e.g., M2S050)
These offer similar logic density, performance, and features. Choose based on power, cost, and ecosystem preferences.
- Xilinx: Kintex-7 (e.g., XC7K70T) or Artix-7 (e.g., XC7A50T)
- Lattice Semiconductor: ECP5 (e.g., LFE5UM-45F)
- Microchip (Microsemi): SmartFusion2 (e.g., M2S050)
These offer similar logic density, performance, and features. Choose based on power, cost, and ecosystem preferences.
Features
The Intel (formerly Altera) EP2AGX65DF29I3N is a member of the Arria II GX FPGA family. Key features:
- 65K logic elements (LEs)
- 4.3 Mb embedded memory
- 288 DSP blocks for high-performance signal processing
- 12 transceivers (3.75 Gbps each), supporting PCIe, GigE, and other protocols
- 1.15V core voltage, 40nm process technology
- 780 user I/O pins (supports LVDS, DDR2/3, and other standards)
- Operating temperature: Industrial (-40°C to +100°C)
- Package: 780-pin FineLine BGA (29x29mm)
Ideal for high-speed communication, embedded systems, and DSP applications.
- 65K logic elements (LEs)
- 4.3 Mb embedded memory
- 288 DSP blocks for high-performance signal processing
- 12 transceivers (3.75 Gbps each), supporting PCIe, GigE, and other protocols
- 1.15V core voltage, 40nm process technology
- 780 user I/O pins (supports LVDS, DDR2/3, and other standards)
- Operating temperature: Industrial (-40°C to +100°C)
- Package: 780-pin FineLine BGA (29x29mm)
Ideal for high-speed communication, embedded systems, and DSP applications.
Pinout
The EP2AGX65DF29I3N is an Arria II GX FPGA from Intel (formerly Altera).
- Pin Count: 780-pin (29x29mm) FineLine BGA package.
- Key Functions:
- Logic Elements: ~65,000 (varies by configuration).
- Transceivers: Up to 12 high-speed (3.75 Gbps) transceivers.
- I/O Pins: ~400 user I/Os (supports LVDS, PCIe, DDR2/3).
- Memory: ~5.5 Mb embedded memory.
- DSP Blocks: ~240 18x18 multipliers.
- Protocol Support: PCIe Gen1/2, Gigabit Ethernet, Serial RapidIO.
Designed for high-performance, low-power applications in communications and signal processing.
- Pin Count: 780-pin (29x29mm) FineLine BGA package.
- Key Functions:
- Logic Elements: ~65,000 (varies by configuration).
- Transceivers: Up to 12 high-speed (3.75 Gbps) transceivers.
- I/O Pins: ~400 user I/Os (supports LVDS, PCIe, DDR2/3).
- Memory: ~5.5 Mb embedded memory.
- DSP Blocks: ~240 18x18 multipliers.
- Protocol Support: PCIe Gen1/2, Gigabit Ethernet, Serial RapidIO.
Designed for high-performance, low-power applications in communications and signal processing.
Manufacturer
The EP2AGX65DF29I3N is an FPGA (Field-Programmable Gate Array) manufactured by Intel (formerly Altera). Intel is a leading multinational semiconductor company known for processors, memory, and programmable logic devices.
Altera, acquired by Intel in 2015, specialized in FPGAs and CPLDs. The EP2AGX65DF29I3N belongs to Altera’s Arria GX series, designed for high-performance applications like communications and embedded systems.
Intel continues to produce and support Altera’s FPGA lineup under its Programmable Solutions Group (PSG). The company is a major player in computing, AI, and data center technologies.
Altera, acquired by Intel in 2015, specialized in FPGAs and CPLDs. The EP2AGX65DF29I3N belongs to Altera’s Arria GX series, designed for high-performance applications like communications and embedded systems.
Intel continues to produce and support Altera’s FPGA lineup under its Programmable Solutions Group (PSG). The company is a major player in computing, AI, and data center technologies.
