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EP2AGX45DF25C4G
+NomenclatureIC FPGA 252 I/O 572FBGA
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FabricantInformations
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Pièce fabricant #EP2AGX45DF25C4G
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Package BGA-572
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En stock2907
365 Garantie qualité 24h/24
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | Arria II GX |
| Part Status | Active |
| Number of LABs/CLBs | 1805 |
| Number of Logic Elements/Cells | 42959 |
| Total RAM Bits | 3517440 |
| Number of I/O | 252 |
| Voltage - Supply | 0.87V ~ 0.93V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Présentation
Description
- 45K logic elements (LEs)
- 1.15Mbits embedded memory
- 12 transceivers (up to 6.375 Gbps)
- 25x25mm, 672-pin FineLine BGA package
- 1.0V core voltage, 2.5V I/O support
- PCIe Gen1/2, Gigabit Ethernet, and DDR2/3 support
Designed for high-speed, low-power applications like communications, industrial, and embedded systems. Offers a balance of performance and power efficiency.
Equivalent
- Xilinx: Kintex-7 (e.g., XC7K70T) or Artix-7 (e.g., XC7A50T) FPGAs.
- Lattice Semiconductor: ECP5 (e.g., LFE5UM-45F).
- Microchip (Microsemi): SmartFusion2 (e.g., M2S050).
These offer similar logic density, performance, and features. Exact replacements depend on specific requirements like power, speed, and I/O.
Features
- 45K logic elements (LEs)
- 1.6Mbits embedded memory
- 288 18x18 multipliers (DSP blocks)
- 12 transceivers (3.75 Gbps each, GXB)
- Support for PCIe Gen1/Gen2
- 25x25mm, 484-pin FBGA package (FineLine BGA)
- 1.0V core voltage, 2.5V/3.3V I/O
- Hard memory controllers (DDR2/3 support)
- Industrial temp range (-40°C to +100°C)
Designed for high-speed serial applications like networking, video, and communications.
Pinout
- Pin Count: 484 pins (FBGA package)
- Key Functions:
- Logic Elements: ~43,680
- Transceivers: 12 high-speed (3.75 Gbps)
- Memory: 2.3 Mb embedded RAM
- I/O: Supports LVDS, PCIe, DDR2/3
- Configuration: JTAG, AS, PS
Designed for high-performance applications like networking and signal processing.