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BMC150
+NomenclatureIMU ACCEL/MAG I2C/SPI 14LGA
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FabricantTechnologie de capteurs Bosch
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Pièce fabricant #BMC150
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En stock5526
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Spécifications
| Attribut | Valeur |
| Part Status | Obsolete |
| Base Product Number | BMC150 |
| Sensor Type | Accelerometer, Magnetometer, 6 Axis |
| Output Type | I2C, SPI |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 14-VFLGA Module |
| Supplier Device Package | 14-LGA (2.2x2.2) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
Présentation
Description
Key features include low power consumption, enabling its use in battery-operated devices, and a small form factor, which makes it suitable for integration into space-constrained applications. The sensor outputs data via an I2C or SPI interface, allowing for easy integration with microcontrollers and other digital systems.
In addition to its hardware capabilities, the BMC150 often comes with software support for sensor fusion, which enhances performance by combining the data from accelerometers and magnetometers to provide more accurate and stable readings. Overall, the BMC150 is valued for its efficiency, precision, and versatility in consumer electronics and industrial applications.
Equivalent
1. InvenSense MPU-9250: Combines a 3-axis gyroscope, accelerometer, and magnetometer.
2. STMicroelectronics LSM303AGR: Offers a 3D accelerometer and a 3D magnetometer.
3. Invensense ICM-20948: Contains a 3-axis gyroscope, accelerometer, and magnetometer.
4. TDK's HMC5883L: A 3-axis digital magnetometer, often paired with an accelerometer for similar functionality.
These products provide comparable 6-axis sensing capabilities for orientation and motion detection.
Features
1. Integration: Combines a 3-axis magnetometer and a 3-axis accelerometer in a single package, facilitating comprehensive motion and orientation sensing.
2. Size and Package: It is compact, featuring a small form factor ideal for space-constrained applications.
3. Low Power Consumption: Engineered for battery-powered devices, ensuring energy efficiency and extended device operation.
4. High Precision: Offers precise measurements for applications requiring accurate direction and motion tracking.
5. Flexible Interfaces: Supports standard digital interfaces like I2C and SPI, enabling easy integration with various microcontrollers and processors.
6. Environmental Resilience: Designed to be robust against environmental interferences, making it suitable for a wide range of conditions.
7. Applications: Commonly used in mobile phones, tablets, wearable devices, and other consumer electronics for navigation, augmented reality, and gaming.
The BMC150 is beneficial in enhancing user experiences by providing accurate and reliable orientation and motion data.
Pinout
1. VDD: Supply voltage.
2. GND: Ground.
3. SDA/SDI: Serial data input for I2C or SPI interface.
4. SCL/SCK: Serial clock line for I2C or SPI interface.
5. CSB: Chip select for SPI interface (active low).
6. INT1: Interrupt output.
7. INT2: Interrupt output.
Other pins may include additional ground, power, or reserved pins, depending on the specific configuration by the manufacturer. The BMC150 is commonly used in mobile devices, gaming controllers, and other applications requiring motion sensing and orientation detection. Always refer to the specific datasheet from the manufacturer for precise pin descriptions and configurations.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the primary function of the BMC150?
A: It is a 6-axis inertial sensor combining a 3-axis accelerometer and a 3-axis magnetometer for motion and orientation detection.
Q: Which communication interfaces does the BMC150 support?
A: It supports both I2C and SPI digital interfaces for flexible integration with microcontrollers.
Q: What is the operating temperature range of this sensor?
A: It is rated for industrial use from -40°C to 85°C, ensuring reliability in harsh environments.
Q: Is the BMC150 suitable for surface mount assembly?
A: Yes, it features a surface mount package (14-LGA) and is supplied in Tape & Reel for automated pick-and-place.
Q: What package size does the BMC150 come in?
A: It comes in a compact 14-VFLGA module measuring 2.2mm x 2.2mm (14-LGA package).
Q: Can the BMC150 be used in new designs today?
A: The part status is marked as "Obsolete," so it is not recommended for new designs; consider current-generation alternatives.