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BGU7031,115
+NomenclatureIC RF AMP GP 40MHZ-1GHZ 6TSSOP
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FabricantNXP USA Inc.
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Pièce fabricant #BGU7031,115
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Fiche technique BGU7031,115 DataSheet
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Package 6-TSSOP, SC-88, SOT-363
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En stock2018
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
Garantie produit authentique
Spécifications
| Attribut | Valeur |
| Supplier | NXP USA Inc. |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Obsolete |
| Frequency | 40MHz ~ 1GHz |
| P1dB | 13dBm |
| Gain | 10dB |
| NoiseFigure | 4.5dB |
| RFType | General Purpose |
| Voltage-Supply | 4.75V ~ 5.25V |
| Current-Supply | 43mA |
| TestFrequency | 1GHz |
| MountingType | Surface Mount |
| Package/Case | 6-TSSOP, SC-88, SOT-363 |
Présentation
Description
The introduction may outline the course goals, such as developing a foundational understanding of a particular field, enhancing specific skills, or preparing students for advanced study or professional applications. Topics might include theoretical frameworks, key concepts, methodologies, or current trends relevant to the subject.
Students can expect to engage with a combination of lectures, readings, discussions, assignments, and assessments designed to facilitate learning and critical thinking. Evaluation might involve exams, projects, or presentations. For concrete details, such as specific topics covered or prerequisites, consulting the course syllabus or instructor is recommended.
Equivalent
Pinout
The primary function of the BGU7031,115 is to amplify weak RF signals while adding minimal noise, making it ideal for enhancing the performance of receivers in wireless communication systems. This device is designed to operate over a wide frequency range and provides high gain, low noise figure, and good linearity. It is often used in applications such as GPS, cellular, and other wireless systems.
Key features include low power consumption, ESD protection, and stability over its operational range. The typical operating voltage is around 2.7V to 3.3V, and it offers a high level of integration with its compact form factor.