Images à titre indicatif uniquement
BGM113A256V21R
+NomenclatureRF TXRX MOD BLUETOOTH CHIP SMD
-
FabricantLaboratoire de silicium
-
Pièce fabricant #BGM113A256V21R
-
En stock4697
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
Garantie produit authentique
Spécifications
| Attribut | Valeur |
| Series | Blue Gecko |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| RF Family/Standard | Bluetooth |
| Protocol | Bluetooth v4.2 |
| Modulation | GFSK |
| Frequency | 2.4GHz ~ 2.484GHz |
| Data Rate | 1Mbps |
| Power - Output | 3dBm |
| Sensitivity | -92dBm |
| Serial Interfaces | I2C, I2S, SPI, UART, USART |
| Antenna Type | Integrated, Chip |
| Utilized IC / Part | EFR32BG |
| Memory Size | 256kB Flash, 32kB RAM |
| Voltage - Supply | 1.85V ~ 3.8V |
| Current - Receiving | 9mA |
| Current - Transmitting | 8.2mA ~ 24.6mA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 36-SMD Module |
| Base Product Number | BGM113 |
Présentation
Description
The BGM113A256V21R is valued for its small form factor, allowing it to be easily integrated into space-constrained applications. It features built-in antenna options and is radio regulatory certified, reducing the time and cost associated with compliance testing. The module is energy-efficient, making it ideal for battery-powered devices, and offers flexible GPIO options for various peripheral interfaces.
Developers benefit from Silicon Labs' robust software development tools, including the Simplicity Studio and Bluetooth SDK, which simplify the development process and enable quick deployment of Bluetooth-enabled products. Overall, the BGM113A256V21R is a versatile solution for integrating BLE connectivity into embedded systems.
Equivalent
Features
1. Bluetooth Low Energy (BLE) Support: Compliant with Bluetooth 4.2 specifications, enabling low-power wireless communication.
2. Integrated MCU: Built-in ARM Cortex-M4 processor with a clock speed of up to 38.4 MHz for efficient processing.
3. Flash and RAM: 256 KB of flash memory and 32 KB of RAM for application storage and execution.
4. Compact Form Factor: Small size, making it suitable for space-constrained devices.
5. Wide Operating Range: Supports a voltage range of 1.8V to 3.8V and operates over a temperature range of -40°C to +85°C.
6. Peripheral Interfaces: Includes USART, I2C, SPI, and GPIO for connectivity with external components.
7. Low Power Consumption: Designed for energy efficiency, suitable for battery-operated devices.
8. Security Features: Includes hardware cryptographic accelerators for secure communications.
9. Certification: Pre-certified for global markets, reducing time to market for product developers.
These features make it ideal for wearable devices, smart home products, and other wireless communication applications.
Pinout
In terms of pin count, the BGM113A256V21R module features 34 pins. These pins provide a variety of functions, including:
1. Power Supply: Pins for voltage supply and ground.
2. GPIOs: General-purpose input/output pins for interfacing with other hardware components.
3. UART/SPI/I2C Interfaces: For serial communication with external devices.
4. ADC Pins: For connecting analog sensors.
5. Reset and Debug: Pins for resetting the module and debugging purposes.
The BGM113A256V21R is specifically designed to be embedded in devices that need Bluetooth connectivity, offering features like low power consumption and a compact form factor suitable for IoT applications. The module simplifies the integration of Bluetooth functionality, allowing developers to focus on application development without the need for deep RF expertise.
Manufacturer
Application
1. Internet of Things (IoT): Used in smart home devices, industrial IoT solutions, and connected appliances.
2. Wearable Technology: Integrated into fitness trackers, smartwatches, and health monitoring devices.
3. Health and Medical Devices: Suitable for wireless medical equipment and remote patient monitoring.
4. Consumer Electronics: Employed in wireless keyboards, mice, and audio accessories.
5. Smart Sensors: Utilized in environmental monitoring and automation systems.
6. Asset Tracking and Location Services: Supports tracking devices and proximity-based applications.
Its low energy consumption and compact form factor make it ideal for these applications.