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BGA7H1N6E6327XTSA1
+NomenclatureIC AMP LTE 2.3-2.69GHZ TSNP6-2
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FabricantTechnologie Infineon
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Pièce fabricant #BGA7H1N6E6327XTSA1
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Fiche technique BGA7H1N6E6327XTSA1 DataSheet
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Package XFDFN-6
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En stock4590
365 Garantie qualité 24h/24
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Spécifications
| Attribut | Valeur |
| Supplier | Infineon Technologies |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| Frequency | 2.3GHz ~ 2.69GHz |
| P1d B | -8dBm |
| Gain | 12.5dB |
| Noise Figure | 0.6dB |
| RF Type | LTE |
| Voltage - Supply | 1.5V ~ 3.3V |
| Supply Current | 4.7mA |
| Mounting Type | Surface Mount |
Présentation
Description
If BGA7H1N6E6327XTSA1 pertains to a Ball Grid Array (BGA), it might be a part or model number for a semiconductor package used in electronics to mount devices such as microprocessors. BGAs are known for their efficient use of space and enhanced performance due to their array of solder balls on the underside.
For a comprehensive understanding or specific details about BGA7H1N6E6327XTSA1, you would typically refer to product documentation, a manufacturer's database, or an industry-specific catalog. Access to these resources would provide accurate and complete information tailored to the context in which the identifier is used.
Equivalent
Pinout
Manufacturer
Application
1. Wireless Communication: Enhancing signal reception in devices like smartphones, tablets, and wireless LANs.
2. Infrastructure: Used in base stations to improve signal clarity and strength.
3. IoT Devices: Amplifying weak signals in the Internet of Things applications.
4. Satellite Communication: Assisting in signal amplification for better transmission and reception.
5. GNSS and GPS Systems: Improving signal sensitivity for location-based services.
These applications benefit from the amplifier's ability to enhance weak input signals while maintaining low noise levels.