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BCM56846A1KFTBLG
+NomenclatureMULTI LAYER SWITCH
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FabricantBroadcom Ltd
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Pièce fabricant #BCM56846A1KFTBLG
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En stock2581
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Part Status | Active |
Présentation
Description
Key features of the BCM56846A1KFTBLG include advanced traffic management, support for virtual LANs (VLANs), quality of service (QoS) features, and enhanced security protocols. It also supports energy-efficient Ethernet standards, helping to reduce power consumption in large-scale deployments.
The chip is built on advanced process technology to ensure high-speed data processing while maintaining low power consumption. Its architecture allows for flexible configurations, catering to various network requirements. The BCM56846A1KFTBLG is often integrated into network switches, routers, and other networking devices that require high throughput and reliable performance.
Equivalent
Features
1. High Port Density: Supports multiple 10 Gigabit Ethernet ports, ideal for large network backbones.
2. Advanced Switching Capabilities: Provides Layer 2 and Layer 3 switching with robust forwarding and routing performance.
3. Scalability: Suitable for scalable network environments, supporting features like Virtual LANs (VLANs) and Quality of Service (QoS).
4. Energy Efficiency: Designed with power-saving features to reduce energy consumption, helping lower operational costs.
5. Enhanced Security: Includes security features like Access Control Lists (ACLs) and secure management interfaces.
6. Programmability: Offers flexibility with support for various network protocols and programmability for custom applications.
This chip is typically used in enterprise and data center environments, offering reliable and efficient network connectivity solutions.
Pinout
Regarding pin count, the BCM56846A1KFTBLG comes in a BGA (Ball Grid Array) package with a specific pin count that can vary based on the package type. Typically, these chips have several hundred balls/pins to accommodate the necessary power, ground, input, output, and signal connections required for its advanced networking functions. However, for precise details about the pin count and specific pin functions, one would need to refer to the technical datasheet or product documentation provided by Broadcom. This documentation will offer detailed pin configuration, electrical characteristics, and functional descriptions necessary for implementation and integration into network hardware.
Manufacturer
Application
1. Data Center Networks: Facilitates efficient and scalable connectivity for servers and storage devices.
2. Enterprise Networking: Supports robust switching solutions in corporate networks.
3. Cloud Computing: Provides the high-speed data transfer necessary for cloud infrastructure.
4. Telecommunications: Enables advanced networking solutions for telecom services.
5. High-Performance Computing: Assists in building networks for computational clusters requiring fast data exchange.
Its versatility and performance make it suitable for complex and demanding networking tasks.