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BCM43602KMLG
+NomenclatureIC RF TXRX WIFI SINGLE CHIP 3X3
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FabricantBroadcom Ltd
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Pièce fabricant #BCM43602KMLG
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En stock2125
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| ProductStatus | Active |
| Type | TxRx Only |
| RFFamily/Standard | WiFi |
| Protocol | 802.11ac |
| Modulation | 256-QAM |
| Frequency | 5GHz |
| DataRate(Max) | 1.3Gbps |
Présentation
Description
Key features of the BCM43602KMLG include support for dual-band wireless connectivity (2.4 GHz and 5 GHz), multi-user MIMO (MU-MIMO) technology for more efficient data transfer, and advanced security protocols to ensure secure connections. It offers high throughput and low latency, making it suitable for applications in smartphones, tablets, laptops, and other consumer electronics.
The chipset typically incorporates advanced power-saving mechanisms to extend battery life in portable devices. Furthermore, it can be integrated with various operating systems and is compatible with numerous device platforms. The BCM43602KMLG is often used in environments requiring robust wireless performance and adherence to the latest Wi-Fi standards.
Equivalent
Features
This chipset also includes beamforming technology, which enhances signal strength and coverage by directing the Wi-Fi signal towards the client devices. It supports advanced security protocols like WPA3 for secure connections and includes low-power modes to conserve energy, making it ideal for battery-powered devices. The BCM43602KMLG is typically used in routers, access points, and other networking equipment, offering reliable Wi-Fi performance with reduced interference and latency. Additionally, it supports Bluetooth 4.1, providing versatile connectivity options for a range of devices.
Pinout
Regarding the pin count and specific pin functions of the BCM43602KMLG, Broadcom's detailed datasheets or technical documentation would provide the most accurate information. However, direct access to such proprietary documentation is often limited to partners or through non-disclosure agreements. Generally, these chips come in a ball grid array (BGA) package with numerous pins (or balls) for power, ground, and various I/O functions, including interfaces like PCIe, USB, and others for communication with host processors.
For precise details on pin count and functions, consulting the manufacturer's datasheet or reaching out to Broadcom directly would be necessary. Additionally, Broadcom's website or contacting a Broadcom distributor might provide further guidance on obtaining technical resources for the BCM43602KMLG.