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AS4C1G16D4-062BIN
+NomenclatureDDR4
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FabricantAlliance Memory, Inc.
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Pièce fabricant #AS4C1G16D4-062BIN
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En stock12373
365 Garantie qualité 24h/24
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Spécifications
| Attribut | Valeur |
| Part Status | Active |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR4 |
| Memory Size | 16Gbit |
| Memory Organization | 1G x 16 |
| Memory Interface | POD |
| Clock Frequency | 1.6 GHz |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.14V ~ 1.26V |
| Operating Temperature | -40°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 96-TFBGA |
| Supplier Device Package | 96-FBGA (9x13) |
| Packaging | Tray |
| Access Time | 19 ns |
Présentation
Description
AS4C1G16D4-062BIN is a DDR4 SDRAM memory chip from the AS4C family (likely by Nanya Technology). The part name typically indicates:
- 1G density (1 Gb)
- x16 data width
- D4 = DDR4 technology
- 062BIN is a manufacturing/lot/packaging code
It’s used as a memory device on boards or modules, requiring DDR4 voltage (about 1.2 V) and standard DDR4 timing specs. For exact speed grade (MT/s), timing (CAS, RCD, RP), and packaging details, refer to the official datasheet for this specific device.
- 1G density (1 Gb)
- x16 data width
- D4 = DDR4 technology
- 062BIN is a manufacturing/lot/packaging code
It’s used as a memory device on boards or modules, requiring DDR4 voltage (about 1.2 V) and standard DDR4 timing specs. For exact speed grade (MT/s), timing (CAS, RCD, RP), and packaging details, refer to the official datasheet for this specific device.
Equivalent
Cross-references depend on the exact memory type (DDR generation, density, width) and packaging. AS4C1G16D4-062BIN (Alliance Memory) may have equivalents from Winbond, Nanya, Micron, Samsung, etc., but exact part numbers vary with speed grade and package. For precise substitutes, provide the speed/voltage and packaging or use Alliance Memory’s cross-reference or distributor tools (Digi-Key, Mouser) by entering the full part number.
Features
AS4C1G16D4-062BIN Features (concise):
- 1 Gbit density per device
- 16-bit data width (x16)
- 4-bank SDRAM architecture
- Synchronous with CK/CK#
- Burst length 4
- Speed grade: -062 (as indicated by the part code)
- 3.3V operation (I/O/core supply specifics per datasheet)
- Auto-refresh and self-refresh modes
- Industrial operating range (typical): -40°C to 85°C
- Pb-free, RoHS-compliant (-BIN package)
- JEDEC-compatible timing profiles for this family
Note: exact timing specs (e.g., CL, tRC, tRP) and voltage margins should be taken from the official datasheet for this lot.
- 1 Gbit density per device
- 16-bit data width (x16)
- 4-bank SDRAM architecture
- Synchronous with CK/CK#
- Burst length 4
- Speed grade: -062 (as indicated by the part code)
- 3.3V operation (I/O/core supply specifics per datasheet)
- Auto-refresh and self-refresh modes
- Industrial operating range (typical): -40°C to 85°C
- Pb-free, RoHS-compliant (-BIN package)
- JEDEC-compatible timing profiles for this family
Note: exact timing specs (e.g., CL, tRC, tRP) and voltage margins should be taken from the official datasheet for this lot.
Pinout
- Pin count: 54 pins (TSOP package)
- Function: 1 Gbit, x16 memory device (SDRAM/DRAM) with a 16‑bit data bus. Pins include DQ0–DQ15 (data), A0–A13 (address), BA0–BA1 (bank address), CS, RAS, CAS, WE, CK/CK#, CKE, DQM0/1 (data mask), and Vcc/Vss/Vddq for power.
- Function: 1 Gbit, x16 memory device (SDRAM/DRAM) with a 16‑bit data bus. Pins include DQ0–DQ15 (data), A0–A13 (address), BA0–BA1 (bank address), CS, RAS, CAS, WE, CK/CK#, CKE, DQM0/1 (data mask), and Vcc/Vss/Vddq for power.
Manufacturer
- Manufacturer: Alliance Memory, Inc.
- What kind of company: A fabless semiconductor company that designs and markets memory ICs (DRAM and SRAM) and outsources fabrication to external foundries.
- What kind of company: A fabless semiconductor company that designs and markets memory ICs (DRAM and SRAM) and outsources fabrication to external foundries.
Application
AS4C1G16D4-062BIN is an Alliance Memory DRAM device. It is used as system memory in products needing high-density, 16‑bit wide DRAM. Typical application areas include:
- Embedded systems and consumer electronics (set-top boxes, Blu-ray/DVD players, smart TVs, digital media players, game consoles)
- Networking and telecommunications equipment (routers, switches, modems)
- Automotive and industrial electronics (infotainment, instrument clusters, industrial controllers) with appropriate grade
- Small-form-factor PCs, OEM motherboards, and memory sub-systems
- Graphics buffers or other DRAM buffers in devices requiring 16-bit wide memory
Note: verify speed, timing and temperature grade (industrial/auto) for your application.
- Embedded systems and consumer electronics (set-top boxes, Blu-ray/DVD players, smart TVs, digital media players, game consoles)
- Networking and telecommunications equipment (routers, switches, modems)
- Automotive and industrial electronics (infotainment, instrument clusters, industrial controllers) with appropriate grade
- Small-form-factor PCs, OEM motherboards, and memory sub-systems
- Graphics buffers or other DRAM buffers in devices requiring 16-bit wide memory
Note: verify speed, timing and temperature grade (industrial/auto) for your application.
Package
62-ball BGA package (BGA-062).
