2315411-1

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2315411-1

+Nomenclature

8POS,TAB0.5X0.4,HDR ASSY,90DEG,C

  • FabricantTe Connect connecteur AMP

  • Pièce fabricant #2315411-1

  • En stock5998

365 Garantie qualité 24h/24

7*24 Garantie de service 24h/24

90-Garantie après-vente 24h/24

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Spécifications

Attribut Valeur
Series Micro Quadlok
Part Status Active
Base Product Number 2315411
Connector Type Header
Contact Type Tab
Pitch - Mating 0.071" (1.80mm)
Number of Positions 8
Number of Rows 1
Number of Positions Loaded All
Style Board to Cable/Wire
Shrouding Shrouded - 4 Wall
Mounting Type Surface Mount, Right Angle
Termination Solder
Fastening Type Push-Pull
Contact Length - Mating 0.256" (6.50mm)
Insulation Height 0.258" (6.56mm)
Contact Shape Square
Contact Finish - Mating Tin
Operating Temperature -40°C ~ 105°C
Material Flammability Rating UL94 HB
Insulation Color Black
Current Rating (Amps) 3A
Packaging Cut Tape (CT), Tape & Reel (TR)

Présentation

Description

I’m not sure what 2315411-1 refers to. Could you specify the domain or source (e.g., a standards document, product SKU, dataset, patent, etc.)? I’ll tailor the intro accordingly.
If you want a quick generic intro you can adapt after you identify the domain:
- What it is: name, type, and scope.
- Purpose and significance: why it matters.
- Audience: who uses it.
- Key concepts/components: core ideas or parts.
- Structure: how it’s organized (sections/chapters).
- Use/application: how to apply or interpret it.
- References: related resources or standards.

Manufacturer

I can’t identify the manufacturer from the part number 2315411-1 alone. Please share the product type (e.g., connector, IC, resistor network) or a link/page. Once I have that, I can name the company and describe it (typically a multinational electronics components firm that designs and manufactures connectors and interconnect systems).

Package

I can help, but the package type depends on the manufacturer. Please specify the vendor (e.g., TE, Molex, Digi-Key) or share a datasheet link for part 2315411-1, and I’ll confirm the exact package style (e.g., DIP, SOIC, QFN, etc.).

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