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10M25DCF484C8G
+NomenclatureIC FPGA 360 I/O 484FBGA
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FabricantInformations
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Pièce fabricant #10M25DCF484C8G
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Package BGA-484
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En stock3416
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 1563 |
| Number of Logic Elements/Cells | 25000 |
| Total RAM Bits | 691200 |
| Number of I/O | 360 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Présentation
Description
- 10M25D: This could indicate a specific series or family of parts. In electronics, prefixes often denote the product line or series.
- CF484: This might refer to the package type or configuration, such as the number of pins or the physical arrangement of the component. "CF" could be an abbreviation for a package type, and "484" could indicate the number of pins.
- C8G: These characters could refer to additional specifications such as temperature range, performance grade, or other part-specific features.
Without a specific reference to a component manufacturer or context, it’s challenging to provide a precise description. Typically, such codes are used in datasheets or product catalogs to uniquely identify products. For accurate information, checking with the component manufacturer or a detailed datasheet would be necessary.
Equivalent
1. Xilinx Spartan-6 series: Offers similar capabilities in low-cost FPGAs.
2. Lattice ECP5 series: Known for low power consumption and cost-effectiveness.
3. Microchip (formerly Microsemi) IGLOO2 series: Provides a balance of cost and performance.
These alternatives offer similar functionalities but may differ slightly in features, power consumption, or performance metrics. Always check the specific requirements of your application when selecting an equivalent.
Features
1. Logic Elements: It offers 25,000 logic elements, providing ample resources for a variety of logic functions and implementations.
2. Embedded Memory: The device includes embedded memory blocks, often totaling up to hundreds of kilobits, which can be used for data storage and buffering.
3. DSP Blocks: It integrates DSP blocks for efficient signal processing tasks, suitable for applications requiring fast mathematical computations.
4. ADC: The MAX 10 series includes integrated analog-to-digital converters (ADCs), allowing for analog signal interfacing without external components.
5. Non-volatile Configuration: The device features non-volatile configuration memory, enabling instant-on functionality without the need for external configuration devices.
6. I/O Options: It supports a variety of I/O standards and has numerous I/O pins, enhancing its flexibility for different interfacing needs.
7. Power Management: Advanced power management features help reduce power consumption, making it suitable for power-sensitive applications.
8. Package: The “484” in the part number indicates the device is available in a 484-pin package, providing a compact form factor for integration into systems.
Pinout
1. Logic Elements (LEs): These FPGAs contain a certain number of logic elements used for implementing custom combinational and sequential logic functions.
2. Memory: They include embedded memory blocks for data storage and processing.
3. DSP Blocks: These are used for digital signal processing tasks.
4. I/O Pins: Configurable for different I/O standards and can be used for communication with other devices.
5. Analog-to-Digital Converters (ADC): MAX 10 devices can include ADCs for applications requiring analog signal processing.
6. Flash Memory: For storing configuration data and user data.
The 10M25DCF484C8G is designed for applications requiring moderate logic density and advanced features in a cost-effective package. For accurate and detailed pin functions, refer to the official datasheet or user manual provided by Intel.