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10M16SAU169I7G
+NomenclatureIC FPGA 130 I/O 169UBGA
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FabricantInformations
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Pièce fabricant #10M16SAU169I7G
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Package BGA-169
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En stock6216
365 Garantie qualité 24h/24
7*24 Garantie de service 24h/24
90-Garantie après-vente 24h/24
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 1000 |
| Number of Logic Elements/Cells | 16000 |
| Total RAM Bits | 562176 |
| Number of I/O | 130 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Présentation
Description
Equivalent
Features
1. Logic Elements (LEs): Offers 16,000 LEs, suitable for implementing complex digital logic functions.
2. Package: Comes in a 169-pin UFBGA (Ultra Fine Ball Grid Array) package.
3. Operating Temperature: Designed for industrial range, with an operating temperature of -40°C to 100°C.
4. Embedded Memory: Provides a substantial amount of embedded memory to support data processing and buffering.
5. I/O Pins: Features numerous I/O pins for interfacing with other components and systems.
6. Embedded Functionality: Includes DSP blocks for efficient digital signal processing tasks.
7. Non-volatile Configuration Memory: This FPGA retains its configuration even when powered down, offering instant-on capability.
8. Single Power Supply: Simplifies power management by requiring only a single voltage supply.
9. Integrated ADCs: Comes with built-in analog-to-digital converters, facilitating analog signal integration.
10. Low Power Consumption: Optimized for applications requiring low power usage.
These features make the 10M16SAU169I7G FPGA suitable for a range of applications, including industrial automation, communications, and consumer electronics.
Pinout
Key functions and features of the 10M16SAU169I7G include:
1. Logic Elements: Full-featured FPGA with around 16,000 logic elements.
2. Embedded Memory: Includes on-chip RAM blocks for efficient data storage and access.
3. DSP Blocks: Contains dedicated DSP blocks for signal processing tasks.
4. Internal Flash Memory: Provides configuration and user flash memory, supporting instant-on and non-volatile storage.
5. I/O Options: Supports various I/O standards and interfaces for connectivity and communication.
6. PLL: Includes phase-locked loops for clock management.
7. Low Power Consumption: Designed for applications requiring efficient power usage.
This versatile FPGA is ideal for applications needing a balance of compute power, memory, and I/O flexibility in a compact form factor.
Manufacturer
Application
1. Industrial Automation: For control systems and data acquisition.
2. Consumer Electronics: In smart devices for customization and interfacing.
3. Automotive: In advanced driver-assistance systems (ADAS) and infotainment.
4. Medical Devices: For signal processing and diagnostics equipment.
5. Communications: Used in wireless and wired communication systems.
6. IoT: For edge computing and smart sensors.
7. Aerospace and Defense: In secure communications and processing solutions.
Its on-chip flash, DSP blocks, and analog-to-digital converters make it suitable for these varied applications.