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10M16SAU169C8G
+NomenclatureIC FPGA 130 I/O 169UBGA
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FabricantInformations
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Pièce fabricant #10M16SAU169C8G
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Package UBGA-169
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En stock7025
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Spécifications
| Attribut | Valeur |
| Package | Tray |
| Series | MAX® 10 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1000 |
| NumberofLogicElements/Cells | 16000 |
| TotalRAMBits | 562176 |
| NumberofI/O | 130 |
| Voltage-Supply | 2.85V ~ 3.465V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 169-LFBGA |
Présentation
Description
The device is housed in a 169-pin UFBGA (Ultra Fine-Pitch Ball Grid Array) package, which offers compactness for space-constrained designs. It supports a wide range of I/O standards, embedded memory, and DSP blocks, making it a flexible choice for processing and control tasks. The MAX 10 family also includes integrated analog-to-digital converters (ADCs) for applications requiring mixed-signal processing.
With on-chip flash memory, the 10M16SAU169C8G allows for instant-on capability and secure configuration. Its low power consumption and diverse functionality make it well-suited for applications requiring efficient and robust programmable logic solutions.
Equivalent
1. Lattice's iCE40 series
2. Microchip's (formerly Microsemi) IGLOO2 series
3. Xilinx's Spartan series
Ensure to match key specifications like logic cells, memory, and power requirements when selecting an alternative. Always verify the compatibility and specific application requirements before choosing a substitute.
Features
1. Logic Elements (LEs): It contains 16,000 LEs, allowing for advanced logic design flexibility.
2. Embedded Memory: The FPGA offers up to 504 Kbits of embedded memory to facilitate complex data handling and processing tasks.
3. DSP Blocks: It includes DSP blocks that support signal processing applications.
4. I/O Pins: The device supports up to 130 user I/O pins for versatile connectivity options.
5. Operating Voltage: It functions at a core voltage of 1.2V, with I/O banks supporting 3.3V and other standard voltage levels.
6. Temperature Range: The component is suitable for commercial temperature ranges, typically from 0°C to 85°C.
7. Embedded Flash: Integrated flash memory for configuration storage, which eliminates the need for an external configuration device.
8. On-Chip ADC: The FPGA includes an analog-to-digital converter for mixed-signal processing.
9. Packages: Available in a compact 169-pin UFBGA package.
These features make the 10M16SAU169C8G ideal for applications requiring flexible logic design, low power consumption, and robust embedded processing capabilities.
Pinout
The pin count of the 10M16SAU169C8G is 169 pins. These pins serve multiple functions, including:
1. Power Supply Pins: For core and I/O power.
2. Configuration Pins: Used during device configuration.
3. I/O Pins: General purpose input/output pins that can be configured for different voltage levels and standards.
4. JTAG Pins: For testing and programming purposes.
5. Clock Pins: Dedicated pins for clock input.
6. Configuration and User Flash Memory Interface.
7. Analog Pins: If applicable, for ADC functionality.
These FPGAs integrate additional features like user flash memory, analog-to-digital converters (ADCs), and temperature sensing, tailored for diverse embedded applications. Always refer to the official datasheet for comprehensive and the most accurate details.
Manufacturer
Application
1. Industrial Automation: Used for real-time processing, control systems, and interfacing with sensors and actuators.
2. Consumer Electronics: Powers devices requiring efficient data processing and connectivity.
3. Communication Systems: Supports protocols and data processing in telecom equipment.
4. Automotive: Utilized in advanced driver-assistance systems (ADAS) and infotainment systems.
5. Medical Devices: Assists in imaging and diagnostic equipment for data processing and control functions.
These application areas leverage the FPGA's reconfigurability, low power consumption, and integrated analog features.