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10M08DAF256I7G
+NomenclatureIC FPGA 178 I/O 256FBGA
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FabricantInformations
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Pièce fabricant #10M08DAF256I7G
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Package LBGA-256
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En stock7199
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 500 |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 387072 |
| Number of I/O | 178 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Présentation
Description
One of the notable features of the 10M08DAF256I7G is its on-chip flash memory, allowing for instant-on configurations and eliminating the need for external configuration devices. This makes it ideal for applications requiring quick start-up times. The FPGA offers embedded memory, DSP blocks, and supports various I/O standards, providing designers with ample resources for diverse applications.
With its Nios II soft processor support, the 10M08DAF256I7G is suitable for embedded applications. Additionally, its non-volatile configuration memory enhances reliability and reduces system costs, making it a versatile choice for industrial, automotive, and consumer electronics markets.
Equivalent
1. Xilinx Spartan-7 series (e.g., XC7S15)
2. Lattice ECP5 series (e.g., LFE5U-25F)
3. Microchip (formerly Microsemi) SmartFusion2 (e.g., M2S010)
These alternatives vary in features and specifications, so ensure they meet your specific design requirements.
Features
1. Logic Elements (LEs): It contains 8,000 LEs, which are the basic building blocks for implementing digital logic.
2. Embedded Memory: Offers up to 387 Kbits of embedded memory, useful for data storage and buffering.
3. I/O Pins: Configurable I/Os with a total of 178 user I/O pins, supporting multiple I/O standards.
4. Integrated Analog-to-Digital Converter (ADC): Includes on-chip ADCs for mixed-signal applications.
5. Non-Volatile Configuration Memory: Allows instant-on functionality as the FPGA retains its configuration after power-off.
6. Power Supply: Supports 3.3V single power supply operation, simplifying power management.
7. Package: Available in a 256-pin FineLine BGA package, providing a compact physical footprint.
8. Temperature Range: Supports industrial temperature range, ensuring reliability in a wide range of environments.
These features make it suitable for diverse applications such as industrial automation, consumer electronics, and more.
Pinout
The device includes up to 8,000 logic elements (LEs) and supports various functions such as digital signal processing (DSP), memory, and general-purpose logic. It features embedded flash memory, which allows for single-chip configuration without the need for an external configuration device. Additionally, it supports analog-to-digital conversion (ADC) capabilities, making it useful for mixed-signal applications.
The 10M08DAF256I7G is designed for industrial-grade applications with an operating temperature range of -40°C to +100°C. This makes it suitable for a wide range of applications, including industrial, automotive, and communication systems. Its versatility and low power consumption are key attributes that enable a broad spectrum of applications.
Manufacturer
Application
1. Industrial Automation: Used in control systems and machine vision.
2. Consumer Electronics: For enhancing device functionality and flexibility.
3. Communications: In signal processing and protocol bridging.
4. Automotive: For infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Used in portable diagnostic equipment.
6. IoT Devices: Facilitates edge computing and connectivity tasks.
7. Data Acquisition: For sensors and monitoring systems.
These application areas leverage its integrated analog functionality, low power consumption, and reconfigurability.