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10M02SCU324C8G
+NomenclatureIC FPGA 246 I/O 324UBGA
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FabricantInformations
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Pièce fabricant #10M02SCU324C8G
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Package LFBGA-324
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En stock1619
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Spécifications
| Attribut | Valeur |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 125 |
| Number of Logic Elements/Cells | 2000 |
| Total RAM Bits | 110592 |
| Number of I/O | 246 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Présentation
Description
The package type, 'U324,' signifies a 324-pin package, specifically the Ultra FineLine BGA (Ball Grid Array), which enhances signal integrity and allows for higher pin count in a compact form factor. The 'C' denotes commercial temperature range, suitable for environments ranging from 0°C to 85°C. The '8' in the part number specifies the speed grade, where higher numbers typically indicate faster performance capabilities but with increased power consumption.
Overall, the 10M02SCU324C8G is designed for applications needing reliable performance and integration, such as industrial automation, automotive systems, and consumer electronics.
Equivalent
Features
1. Logic Elements (LEs): It contains 2,000 LEs, which are the building blocks for implementing custom digital logic circuits.
2. Package: It comes in a 324-pin UBGA (Ultra-thin Ball Grid Array) package, which is suitable for compact applications.
3. Embedded Memory: The FPGA includes embedded memory blocks, which are useful for creating buffers, FIFOs, or small RAM blocks within the FPGA design.
4. Embedded Multiplier Blocks: These are used for efficient implementation of DSP functions such as signal processing and filtering.
5. Non-Volatile Configuration Memory: The FPGA configuration can be stored internally, allowing it to retain its programming even after power-off.
6. Integrated Analog-to-Digital Converters (ADCs): Useful for mixed-signal applications where there is a need to interface with analog inputs.
7. I/O Pins: It offers numerous I/O pins for interfacing with other components and peripherals.
8. Low Power Consumption: Designed for efficient power usage, which is critical for battery-powered or power-sensitive applications.
9. Operating Temperature Range: Supports industrial temperature ranges, making it suitable for a variety of environments.
Pinout
Key functions and features include:
1. Logic Elements (LEs): It contains 2,000 logic elements, which are the building blocks for implementing custom digital circuits.
2. User Flash Memory: Offers integrated flash memory for user data and FPGA configuration.
3. Embedded memory blocks: Provides embedded memory blocks for efficient data storage and retrieval.
4. DSP Blocks: Contains DSP blocks for signal processing applications.
5. I/O Pins: Offers a wide range of configurable I/O pins for interfacing with other devices, supporting standards such as LVTTL, LVCMOS, and more.
6. PLL (Phase-Locked Loops): Incorporates PLLs for clock management.
This device is ideal for applications requiring a balance between cost, performance, and power efficiency, such as industrial automation, consumer electronics, and data acquisition systems.
Manufacturer
Application
1. Embedded Systems: Used for designing low-power, compact systems with flexible I/O configurations.
2. Industrial Automation: Offers reliable processing power for controlling machinery and processes.
3. Consumer Electronics: Utilized for enhancing device functionalities and supporting advanced features.
4. Communication Systems: Implements protocols and supports data processing and signal handling.
5. Automotive: Assists in control systems, infotainment, and ADAS (Advanced Driver Assistance Systems).
6. Prototyping and Development: Facilitates the development of new algorithms and hardware designs through reprogrammable logic.
These areas leverage the FPGA's capabilities in processing, flexibility, and integration.