AM1808EZWTD4
Texas Instruments
- Lifecycle
- Active
- Stock
- 4891 PCS
- Package
- NFBGA-361
- Series
- Microprocesseur intégré
Cette comparaison détaillée des composants AM1808EZWTD4 et AM1806BZCED4 vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The AM1806BZCED4 is a viable functional replacement candidate for the AM1808EZWTD4 in applications where reduced on-chip memory and a lower maximum clock rate are acceptable. Both devices share the same ARM926EJ-S core, BGA package footprint, and industrial temperature range, but the AM1808EZWTD4 offers higher on-chip RAM and a faster core clock, so designers must validate memory footprint and timing margins before substituting.
Texas Instruments
Texas Instruments
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1808EZWTD4 | AM1806BZCED4 | Why it matters |
|---|---|---|---|
| Core Processor | ARM926EJ-S | ARM926EJ-S | Both use the same ARM926EJ-S core, so instruction set and software compatibility are preserved. |
| Max Clock Frequency | 456 MHz | 456 MHz | Identical clock speed means equivalent processing throughput for timing-sensitive applications. |
| Package / Case | 361-LFBGA (16x16) | 361-NFBGA (16x16) | Package footprint and ballout must match for a drop-in board replacement; differing package types may affect assembly and thermal behavior. |
| Operating Temperature Range | -40°C to 90°C (TJ) | -40°C to 90°C (TJ) | Matching temperature grades ensure the substitute meets the same environmental reliability requirements. |
| On-Chip RAM | 128KB | 128KB | Equal internal SRAM supports the same buffer and stack requirements without external memory changes. |
| Number of Cores | 1 | 1 | Single-core configuration keeps software architecture and scheduling identical. |
| Voltage - I/O | 1.8V, 3.3V | 1.8V, 3.3V | Same I/O voltage levels allow direct connection to existing peripherals without level shifting. |
| Ethernet | 10/100 Mbps (1) | 10/100 Mbps (1) | Identical Ethernet MAC capability preserves networking functionality in the design. |
| USB | USB 2.0 + PHY (2) | USB 2.0 + PHY (2) | Same USB controller and integrated PHY count supports the same host/device connectivity. |
| Supplier Device Package | 361-NFBGA (16x16) | 361-NFBGA (16x16) | Matching supplier package ensures the part can be placed on the same PCB land pattern. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1808EZWTD4 | AM1806BZCED4 |
|---|---|---|
| Supplier | - | Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 456MHz | 456MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | -40°C ~ 90°C (TJ) |
| Ethernet | 10/100Mbps (1) | - |
| SATA | SATA 3Gbps (1) | - |
The AM1808EZWTD4 is an ARM926EJ-S based Sitara processor running at 456 MHz in a 361-ball NFBGA (ZWT) package, while the AM1806BZCED4 is an ARM926EJ-S based Sitara processor running at 456 MHz in a 361-ball NFBGA (ZCE) package. Both are members of the AM180x family, but the AM1808 includes an LCD controller and additional peripherals, whereas the AM1806 omits the LCD controller. Package ballout and thermal characteristics differ between the ZWT and ZCE packages, so PCB footprint and thermal design must be validated separately.
No. The AM1808EZWTD4 uses the ZWT (361-ball NFBGA) package and the AM1806BZCED4 uses the ZCE (361-ball NFBGA) package. Although both are 361-ball NFBGA packages, the ball assignments and package outlines are defined separately in the respective datasheets, so they are not drop-in replacements. A PCB redesign or layout review is required before substitution.
Yes. Both the AM1808EZWTD4 and AM1806BZCED4 are specified at a 456 MHz ARM926EJ-S core clock, per the Texas Instruments AM1808 and AM1806 datasheets. The "D4" speed grade in both part numbers corresponds to the 456 MHz bin.
The AM1808 integrates an LCD controller (LCDC) supporting raster and passive displays, while the AM1806 does not include an LCD controller. Both devices share the ARM926EJ-S core, 10/100 Ethernet MAC, USB 2.0 OTG, UART, SPI, I2C, McASP, and other common AM180x peripherals as documented in the respective TI datasheets. Designs requiring display output must use the AM1808.
Yes. Both the AM1808EZWTD4 and AM1806BZCED4 are rated for the industrial temperature range of -40°C to +90°C (case temperature), as specified in the Texas Instruments AM1808 and AM1806 datasheets. The "D4" suffix in both part numbers denotes the 456 MHz industrial temperature grade.
Not directly. Because the AM1806 lacks the LCD controller present on the AM1808 and uses a different package ballout (ZCE vs ZWT), substitution requires verifying that the design does not use the LCD controller, confirming pin function mapping against both datasheets, and validating the PCB layout and thermal performance. TI documentation should be consulted before any substitution.
Both devices support a 16/32-bit DDR2/mDDR SDRAM interface, asynchronous EMIF (NOR/NAND flash, SRAM), and a dedicated NAND flash controller, as documented in the TI AM1808 and AM1806 datasheets. The memory subsystem is common across the AM180x family, so memory interface configuration is the same for both parts.