AM1802EZWTD3
Texas Instruments
- Lifecycle
- Active
- Stock
- 3390 PCS
- Package
- NFBGA-361
- Series
- Microprocesseur intégré
Cette comparaison détaillée des composants AM1802EZWTD3 et AM1806BZCED4 vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The AM1802EZWTD3 and AM1806BZCED4 are not drop-in replacements for one another. They differ in core architecture, package footprint, and operating conditions, so a direct board-level substitution is not feasible without redesign and revalidation.
Texas Instruments
Texas Instruments
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | AM1802EZWTD3 | AM1806BZCED4 | Why it matters |
|---|---|---|---|
| Core Architecture | ARM926EJ-S (ARM9) | ARM926EJ-S (ARM9) | Both use the same ARM9 core, so instruction set and software compatibility are preserved. |
| Maximum CPU Clock Frequency | 300 MHz | 456 MHz | A higher clock rate provides more processing headroom; the AM1806 can run faster code than the AM1802. |
| On-Chip RAM (SRAM) | 8 KB | 128 KB | Larger internal SRAM reduces reliance on external memory and improves deterministic performance. |
| Package / Pin Count | 361-ball NFBGA (ZWT) | 361-ball NFBGA (ZCE) | Package and pinout determine board layout compatibility; different ball maps may require PCB redesign. |
| Operating Temperature Range | -40°C to +90°C (extended) | -40°C to +90°C (extended) | Identical temperature ratings mean both suit the same industrial environments. |
| USB Support | USB 2.0 OTG (high-speed) | USB 2.0 OTG (high-speed) | Matching USB capability preserves peripheral connectivity options. |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | Both integrate the same Ethernet MAC, so networking designs remain compatible. |
| LCD Controller | Not available | Integrated LCD controller | The AM1806 can drive a display directly, while the AM1802 cannot, affecting display-based applications. |
| MMC/SD Controller | 2x MMC/SD | 2x MMC/SD | Same storage interface count supports identical flash/SD card designs. |
| Supply Voltage (Core) | 1.2 V core | 1.2 V core | Identical core voltage simplifies power supply design and reuse. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | AM1802EZWTD3 | AM1806BZCED4 |
|---|---|---|
| Supplier | - | Texas Instruments |
| Series | Sitara™ | Sitara™ |
| Part Status | Active | Obsolete |
| Core Processor | ARM926EJ-S | ARM926EJ-S |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 300MHz | 456MHz |
| Co - Processors / DSP | System Control; CP15 | System Control; CP15 |
| RAM Controllers | LPDDR, DDR2 | LPDDR, DDR2 |
| Graphics Acceleration | No | No |
| Display&Interface Controllers | LCD | LCD |
| USB | USB 2.0 + PHY (1) | USB 2.0 + PHY (1) |
| Voltage - I / O | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | -40°C ~ 90°C (TJ) |
| Ethernet | 10/100Mbps (1) | - |
The AM1802EZWTD3 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZWT) package, while the AM1806BZCED4 is an ARM926EJ-S based Sitara processor in a 361-ball NFBGA (ZCE) package. Both are members of the AM180x family, but they differ in operating temperature range, package ballout, and specific peripheral configurations as defined in their respective datasheets.
No. Although both devices use a 361-ball NFBGA package, the AM1802EZWTD3 uses the ZWT package designation and the AM1806BZCED4 uses the ZCE package designation. These are distinct package ballouts with different pin assignments, so they are not drop-in replacements for each other. Designers must verify the ball map in the respective datasheets before considering any layout change.
The AM1802EZWTD3 is specified for the extended commercial temperature range (0°C to 90°C, indicated by the "D3" speed/grade suffix), while the AM1806BZCED4 is specified for the industrial temperature range (-40°C to 90°C, indicated by the "ED4" suffix). The industrial-grade AM1806BZCED4 is suitable for applications requiring operation below 0°C.
Yes. Both the AM1802EZWTD3 and AM1806BZCED4 integrate an ARM926EJ-S RISC core. The "D3" suffix on the AM1802EZWTD3 and the "D4" suffix on the AM1806BZCED4 denote different maximum operating frequencies as defined in the AM180x datasheet (SPRS596). Designers should confirm the exact rated frequency for each orderable part number against the manufacturer's datasheet.
Not directly. Because the two parts use different package ballouts (ZWT vs ZCE) and different temperature grades, a direct substitution is not possible without a PCB redesign and thermal validation. The AM1806BZCED4 offers industrial temperature operation, but its pin assignments differ from the AM1802EZWTD3, so the schematic and layout must be re-verified against the AM1806 datasheet.
Both devices are part of the AM180x Sitara family and share core peripherals including the ARM926EJ-S core, on-chip RAM, EMIF, UART, SPI, I2C, and USB interfaces as documented in the AM180x datasheet. However, the exact peripheral set and pin multiplexing differ between the ZWT and ZCE package variants, so each orderable part number's peripheral availability must be confirmed from its specific datasheet section.
The AM1806BZCED4 should be selected for industrial-temperature applications because its "ED4" suffix denotes an industrial temperature grade of -40°C to 90°C. The AM1802EZWTD3's "D3" suffix corresponds to the extended commercial temperature range (0°C to 90°C), which does not cover sub-zero operation. Selection must be based on the verified temperature specification in the manufacturer's datasheet.