Part A
ADG436BRZ-REEL
Analog Equipment GmbH.
- Lifecycle
- Active
- Stock
- 1589 PCS
- Series
- Interfaces - commutateurs analogiques, multiplexeurs, démultiplexeurs
Replacement verdict
Not a drop-in replacement
ADG436BRZ-REEL and ADG433BCHIPS are not drop-in replacements for each other. The ADG436BRZ-REEL is a dual SPDT switch in a standard SOIC package, while the ADG433BCHIPS is a quad SPST switch supplied as bare die, so switch configuration, channel count, and physical form factor all differ. Designers must validate pinout, assembly method, and circuit topology before considering any substitution.
Different switch configuration
Different channel count
Different package form factor
Different assembly method
Parts at a glance
Part B
ADG433BCHIPS
Analog Equipment GmbH.
- Lifecycle
- Active
- Stock
- 7365 PCS
- Package
- Die
- Series
- Interfaces - commutateurs analogiques, multiplexeurs, démultiplexeurs
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | ADG436BRZ-REEL | ADG433BCHIPS | Why it matters |
|---|---|---|---|
| Switch Configuration | 2 x SPDT (dual SPDT) | 4 x SPST (quad SPST, NC) | Determines the switching topology; a dual SPDT cannot directly replace a quad SPST in signal routing without redesigning the circuit. |
| Number of Channels | 2 | 4 | Channel count affects how many independent signals can be routed; fewer channels may require additional packages. |
| On-Resistance (RON) | ~45 Ω (typ at ±15 V) | ~45 Ω (typ at ±15 V) | RON impacts signal attenuation and insertion loss; similar values suggest comparable analog signal fidelity. |
| Supply Voltage Range | ±15 V dual / +12 V single (up to ±20 V) | ±15 V dual / +12 V single (up to ±20 V) | Defines the operating window; matching ranges allow use in the same power rails without level shifting. |
| Package / Mounting | 16-lead SOIC (surface mount, reel) | Die (bare chip) | Package form factor dictates PCB footprint and assembly method; a bare die requires wire bonding and cannot drop into a SOIC footprint. |
| Operating Temperature Range | -40 °C to +85 °C | -40 °C to +85 °C | Temperature range confirms suitability for industrial environments; identical ranges mean equivalent thermal tolerance. |
| Switch Action | Break-before-make (SPDT) | Normally closed (NC) SPST | Switch action affects transient behavior and default signal path; NC vs break-before-make changes power-up state and glitch performance. |
| Channel-to-Channel Matching | ~5 Ω (typ) | ~5 Ω (typ) | Matching ensures consistent gain across channels; comparable matching supports similar multi-channel accuracy. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | ADG436BRZ-REEL | ADG433BCHIPS |
|---|---|---|
| Supplier | - | Analog Devices Inc. |
| Part Status | Active | Active |
| Switch Circuit | SPDT | SPST - NO/NC |
| Multiplexer / Demultiplexer Circuit | 2:1 | 1:1 |
| Number of Circuits | 2 | 4 |
| On - State Resistance(Max) | - | 24Ohm |
| Channel - to - Channel Matching(ΔRon) | - | 1.2Ohm |
| Voltage - Supply, Single (V+) | 3V ~ 30V | 10.8V ~ 13.2V, ±13.5V ~ 16.5V |
| Voltage - Supply, Dual (V±) | ±3V ~ 20V | 10.8V ~ 13.2V, ±13.5V ~ 16.5V |
| Switch Time(Ton Toff)(Max) | - | 90ns, 60ns |
| Charge Injection | 10pC | 5pC |
| Channel Capacitance(CS(off)CD(off)) | - | 9pF, 9pF |
| Current - Leakage(IS(off))(Max) | - | 250pA |
| Crosstalk | -90dB @ 1MHz | -85dB @ 1MHz |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount |
| Base Product Number | ADG436 | - |
| On - State Resistance (Max) | 12Ohm (Typ) | - |
| Channel - to - Channel Matching (ΔRon) | 1Ohm | - |
| Switch Time (Ton, Toff) (Max) | 70ns, 60ns (Typ) | - |
| Channel Capacitance (CS(off), CD(off)) | 13pF | - |
| Current - Leakage (IS(off)) (Max) | 250pA | - |
| Packaging | Cut Tape (CT), Tape & Reel (TR) | - |
Frequently asked questions
What are the key differences between the ADG436BRZ-REEL and ADG433BCHIPS?
The ADG436BRZ-REEL is a dual SPDT analog switch in a 16-lead SOIC package supplied on tape and reel, while the ADG433BCHIPS is a quad SPST analog switch supplied as bare die. They differ in switch configuration, channel count, and physical form factor, so they are not interchangeable in a given design.
What switch configuration and channel count does each device provide?
The ADG436BRZ-REEL provides two independently selectable SPDT (single-pole double-throw) switches. The ADG433BCHIPS provides four independently controlled SPST (single-pole single-throw) switches.
What are the supply voltage and analog signal range specifications for these parts?
Both devices are specified for dual-supply operation of ±15 V (with a permissible range of ±10 V to ±15 V) and can also operate from a single +12 V supply. Their analog signal range extends to the supply rails, and both are fabricated on the same CMOS process family with typical on-resistance in the tens of ohms.
How do the packages differ, and what does that mean for assembly?
The ADG436BRZ-REEL is housed in a 16-lead SOIC (surface-mount) package and is shipped in tape-and-reel format for automated pick-and-place assembly. The ADG433BCHIPS is a bare semiconductor die intended for chip-on-board or hybrid assembly, requiring die attach and wire bonding rather than standard SMT reflow.
Can the ADG433BCHIPS be used as a drop-in replacement for the ADG436BRZ-REEL?
No. The two parts differ in switch topology (quad SPST versus dual SPDT), channel count, and physical form (bare die versus SOIC package). A direct substitution is not possible without redesigning the circuit and assembly process.
What are the typical applications for each device?
The ADG436BRZ-REEL is typically used for signal routing, audio switching, and multiplexing where two SPDT channels are needed in a standard SMT assembly. The ADG433BCHIPS is typically used in space-constrained or custom hybrid circuits where bare-die integration is required, such as in multi-chip modules or specialized instrumentation.
Are both devices specified for the same operating temperature range?
Both devices are specified for the industrial temperature range of −40 °C to +85 °C, consistent with the standard ADG4xx CMOS switch family specifications.