Part A
5CEFA9F27I7N
Informations
- Lifecycle
- Active
- Stock
- 7586 PCS
- Package
- BGA-672
- Series
- FPGA embarqué (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2U19A7N are not drop-in replacements for one another. They differ fundamentally in logic density, package footprint, and I/O count, making them suitable for different design scales and board layouts. The 5CEFA9F27I7N offers significantly higher logic capacity and I/O in a larger FBGA package, while the 5CEFA2U19A7N provides a compact, lower-density alternative in a smaller UBGA package. Designers must evaluate their logic requirements, PCB space, and I/O needs before considering any substitution.
Different logic density
Different package type
Different I/O count
Different footprint
Parts at a glance
Part B
5CEFA2U19A7N
Informations
- Lifecycle
- Active
- Stock
- 2002 PCS
- Package
- FBGA-484
- Series
- FPGA embarqué (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2U19A7N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain, IP, and pinout conventions are compatible for substitution. |
| Logic Elements (LE) | 301,000 | 25,000 | LE count determines available logic capacity; a large mismatch means the parts are not functionally interchangeable for complex designs. |
| Total RAM (bits) | 12,200,448 | 1,536,000 | On-chip memory affects buffering, FIFO depth, and data storage capability; significant differences limit drop-in replacement. |
| 18x18 Multipliers | 684 | 72 | DSP block count governs arithmetic throughput for signal processing; fewer multipliers restrict compute-intensive applications. |
| Package | FBGA-672 | UBGA-484 | Different package footprints and ball counts prevent direct PCB replacement without redesign. |
| Number of I/Os | 336 | 224 | I/O count limits peripheral and interface connectivity; fewer pins may not support the same system interfaces. |
| Operating Temperature | -40°C to 100°C (TJ) | -40°C to 125°C (TJ) | Temperature grade affects reliability in harsh environments; differing ranges impact suitability for industrial or automotive use. |
| Supply Voltage (Core) | 1.07V to 1.13V | 1.07V to 1.13V | Core voltage compatibility ensures power supply designs remain valid across both parts. |
| Transceiver Count | 9 | 3 | High-speed serial transceivers enable protocols like PCIe and Ethernet; fewer transceivers limit high-bandwidth communication options. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F27I7N | 5CEFA2U19A7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 336 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 125°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2U19A7N?
The 5CEFA9F27I7N is a Cyclone V FPGA with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers in a 672-pin FBGA package. The 5CEFA2U19A7N is a Cyclone V FPGA with 25,000 logic elements, 1,864 Kbits of embedded memory, and 72 18x18 multipliers in a 484-pin UBGA package. They differ significantly in logic density, memory resources, DSP resources, package, and I/O count.
Are the 5CEFA9F27I7N and 5CEFA2U19A7N pin-to-pin compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package, while the 5CEFA2U19A7N uses a 484-pin UBGA package. The different package types, pin counts, and ball maps make them physically and electrically incompatible for direct PCB replacement.
Can the 5CEFA2U19A7N be used as a direct substitute for the 5CEFA9F27I7N in an existing design?
No. The 5CEFA2U19A7N has substantially fewer logic elements (25,000 vs. 301,000), less embedded memory (1,864 Kbits vs. 13,917 Kbits), fewer multipliers (72 vs. 480), and a different package. A direct substitution is not possible without redesigning the FPGA configuration, PCB footprint, and verifying all timing and resource requirements.
Do both devices belong to the same Intel Cyclone V FPGA family?
Yes. Both the 5CEFA9F27I7N and 5CEFA2U19A7N are members of the Intel Cyclone V FPGA family, specifically the E variant (5CEFA). They share the same architecture, but differ in density, package, and resource counts.
What are the operating temperature ranges for these two FPGAs?
Both the 5CEFA9F27I7N and 5CEFA2U19A7N are specified with an industrial temperature grade, indicated by the "I" in the part number. The industrial temperature range for Cyclone V devices is typically -40°C to +100°C junction temperature (TJ). Designers should confirm the exact thermal limits from the respective Intel datasheet.
Which device offers more embedded memory and DSP resources?
The 5CEFA9F27I7N offers significantly more embedded memory (13,917 Kbits vs. 1,864 Kbits) and DSP resources (480 18x18 multipliers vs. 72) compared to the 5CEFA2U19A7N. This makes the 5CEFA9F27I7N better suited for memory-intensive and DSP-heavy applications.
Are the speed grades of the 5CEFA9F27I7N and 5CEFA2U19A7N the same?
Yes. Both part numbers include the "7" speed grade designation, indicating they are specified for the same speed grade within the Cyclone V family. However, actual achievable performance depends on the specific design, resource utilization, and package thermal characteristics.
What package types are used by the 5CEFA9F27I7N and 5CEFA2U19A7N?
The 5CEFA9F27I7N is housed in a 672-pin FineLine BGA (FBGA) package. The 5CEFA2U19A7N is housed in a 484-pin Ultra FineLine BGA (UBGA) package. These packages have different footprints, ball pitches, and thermal profiles.