5CEBA4F17C8N
Informations
- Lifecycle
- Active
- Stock
- 2430 PCS
- Package
- FBGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Cette comparaison détaillée des composants 5CEBA4F17C8N et 5CEBA4F17C7N vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The 5CEBA4F17C7N is a functionally compatible alternative to the 5CEBA4F17C8N, sharing identical logic density, package, and I/O configuration, with the only meaningful distinction being the faster core speed grade of the C7N variant. Designers should validate timing closure and power dissipation at the higher operating frequency before substituting.
Informations
Informations
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA4F17C8N | 5CEBA4F17C7N | Why it matters |
|---|---|---|---|
| Speed Grade | 8 | 7 | Speed grade determines the maximum operating frequency and timing closure margin; a higher number indicates a faster device, so these parts are not drop-in equivalent for timing-critical designs. |
| Family / Series | Cyclone V E | Cyclone V E | Same device family ensures identical architecture, IP compatibility, and tool support, which is essential for functional substitutability. |
| Logic Elements (LE) | 49000 | 49000 | Logic capacity must match to fit the same design without resource overflow or re-architecture. |
| Package | FBGA-256 | FBGA-256 | Identical package guarantees the same footprint, pinout, and PCB layout compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Matching temperature grades ensure the device meets the same environmental and reliability requirements. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match to ensure power delivery design and thermal characteristics remain valid. |
| Embedded Memory | 3080 kbit | 3080 kbit | On-chip memory capacity affects the ability to implement buffers, FIFOs, and soft processors without external memory. |
| Number of I/O Pins | 224 | 224 | I/O count determines interface capability and must match for the same board-level connectivity. |
| Transceiver Count | 0 | 0 | Presence or absence of high-speed transceivers dictates support for protocols like PCIe or Ethernet; both lack them, so they are equivalent in this respect. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA4F17C8N | 5CEBA4F17C7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 18480 |
| Number of Logic Elements/Cells | 49000 | 49000 |
| Total RAM Bits | 3464192 | 3464192 |
| Number of I/O | 128 | 128 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The primary difference is the speed grade. The 5CEBA4F17C8N is a speed grade 8 device, while the 5CEBA4F17C7N is a speed grade 7 device. Both are Intel (formerly Altera) Cyclone V E series FPGAs in the same 256-ball FBGA package (17 mm x 17 mm) with the same logic density and I/O count. The higher speed grade (8) offers faster timing performance but typically at a higher cost and power consumption compared to speed grade 7.
Yes. Both devices share the same package designation (F17, 256-ball FBGA) and the same device family (Cyclone V E). According to Intel documentation, devices with the same package and device part number but different speed grades are pin-to-pin compatible. However, always verify the specific pinout in the respective device datasheet before layout.
Substitution is possible only if the design's timing requirements are met by the slower speed grade 7 device. The 5CEBA4F17C7N has slower maximum operating frequencies and longer propagation delays than the 5CEBA4F17C8N. You must re-run static timing analysis with the speed grade 7 timing model to confirm all timing constraints are satisfied. If the design was closed with speed grade 8 and has no timing margin, the substitution may fail.
Both the 5CEBA4F17C8N and 5CEBA4F17C7N are commercial-grade devices, indicated by the "C" in the part number. The operating junction temperature range for commercial-grade Cyclone V devices is 0°C to 85°C (case temperature). Industrial-grade versions would have an "I" suffix instead of "C".
Yes. Both the 5CEBA4F17C8N and 5CEBA4F17C7N belong to the same Cyclone V E family and support identical configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration bitstreams are not interchangeable between speed grades; you must generate a separate programming file for each speed grade.
Choose the 5CEBA4F17C8N (speed grade 8) if your design requires the highest performance and timing margin, or if your logic utilization is high. Choose the 5CEBA4F17C7N (speed grade 7) if your design meets timing at the lower speed grade and you want to reduce cost and power consumption. Intel's Quartus Prime software can target both speed grades for timing analysis.
Yes. Both devices require the same power supply rails as specified in the Cyclone V device datasheet: VCCINT (1.1 V), VCCAUX (2.5 V), VCCIO (variable, 1.2 V to 3.3 V depending on I/O standard), and VCCA (2.5 V for transceiver if used). The speed grade does not change the nominal supply voltages, though total power consumption may differ due to different static and dynamic power characteristics.
Yes. Both the 5CEBA4F17C8N and 5CEBA4F17C7N use the same 256-ball FBGA package with 17 mm x 17 mm body size and 1.0 mm ball pitch. The PCB land pattern, solder ball arrangement, and mechanical dimensions are identical. You can design one PCB footprint that accepts either speed grade.