Part A
5CEBA2F17C8N
Informations
- Lifecycle
- Active
- Stock
- 4153 PCS
- Package
- BGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEBA2F17C8N and 5CEBA4U15I7N are both Intel Cyclone V FPGA devices sharing the same core architecture and logic fabric family, making them functionally related candidates. However, they differ in logic density, package footprint, and operating temperature grade, so a direct drop-in replacement is not possible without design and PCB revisions. The 5CEBA4U15I7N offers higher logic capacity and an industrial temperature rating, while the 5CEBA2F17C8N provides a lower-density, commercial-grade option in a different package. Validation of pinout, power, and thermal requirements is required before substitution.
Logic Density
Validation required
Package Type
Not compatible
Operating Temperature
Validation required
Core Architecture
High match
Parts at a glance
Part B
5CEBA4U15I7N
Informations
- Lifecycle
- Active
- Stock
- 3835 PCS
- Package
- BGA-324
- Series
- FPGA embarqué (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA2F17C8N | 5CEBA4U15I7N | Why it matters |
|---|---|---|---|
| Family | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain and IP compatibility for substitution. |
| Logic Elements (LE) | 25,000 | 49,000 | Logic capacity determines whether a design fits; the larger device offers nearly double the resources. |
| Package | FBGA-256 (17x17 mm) | UBGA-324 (15x15 mm) | Different package footprint and ball count prevent direct PCB drop-in replacement. |
| Operating Temperature | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | Industrial rating is required for harsh environments; commercial parts may not meet those specs. |
| Speed Grade | 8 | 7 | Speed grade affects maximum clock frequency and timing closure; grade 7 is faster than grade 8. |
| Total I/O Pins | 128 | 224 | I/O count limits peripheral interfaces; the U15 package provides significantly more user I/O. |
| Embedded Memory | 1,080 Kbit | 3,080 Kbit | On-chip memory affects buffering and data storage capability within the FPGA fabric. |
| 18x18 Multipliers | 36 | 70 | DSP blocks determine signal processing throughput for arithmetic-intensive designs. |
| PLLs | 4 | 4 | PLL count affects clock domain generation; identical count supports similar clocking architectures. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage compatibility simplifies power supply design when swapping devices. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA2F17C8N | 5CEBA4U15I7N |
|---|---|---|
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 18480 |
| Number of Logic Elements/Cells | 25000 | 49000 |
| Total RAM Bits | 2002944 | 3464192 |
| Number of I/O | 128 | 176 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEBA2F17C8N and the 5CEBA4U15I7N?
The 5CEBA2F17C8N is a Cyclone V E FPGA with 25,000 logic elements, a 484-pin FBGA package (17 mm x 17 mm), and commercial temperature grade (0°C to 85°C junction). The 5CEBA4U15I7N is a Cyclone V E FPGA with 49,000 logic elements, a 324-pin UBGA package (15 mm x 15 mm), and industrial temperature grade (-40°C to 100°C junction). They differ in logic density, package, pin count, and temperature range.
Are the 5CEBA2F17C8N and 5CEBA4U15I7N pin-to-pin compatible?
No. The 5CEBA2F17C8N uses a 484-pin FBGA package, while the 5CEBA4U15I7N uses a 324-pin UBGA package. The different package sizes, ball counts, and ball maps prevent direct PCB footprint compatibility.
Can the 5CEBA2F17C8N be used as a direct drop-in replacement for the 5CEBA4U15I7N?
No. Beyond the package and pin count differences, the 5CEBA4U15I7N offers approximately twice the logic density (49,000 LEs vs. 25,000 LEs) and a wider industrial temperature range. A direct replacement would require a new PCB layout, recompilation of the FPGA design, and validation of timing, power, and thermal performance.
What are the operating temperature ranges for these two FPGAs?
The 5CEBA2F17C8N is rated for commercial temperature operation with a junction temperature range of 0°C to 85°C. The 5CEBA4U15I7N is rated for industrial temperature operation with a junction temperature range of -40°C to 100°C. The industrial-grade device is suitable for harsher environments.
Do both devices belong to the same FPGA family and use the same configuration method?
Yes. Both are members of the Intel (formerly Altera) Cyclone V E family. They share the same configuration architecture, supporting active serial, passive serial, JTAG, and fast passive parallel configuration schemes. Configuration bitstreams are device-specific and must be regenerated for each part number.
What are the typical applications for each device given their differences?
The 5CEBA2F17C8N, with lower logic density and commercial temperature rating, is typically used in cost-sensitive consumer, industrial control, and communication applications with moderate processing needs. The 5CEBA4U15I7N, with higher logic density and industrial temperature rating, is suited for automotive, industrial automation, and outdoor equipment requiring more logic resources and wider temperature tolerance.
Are the power supply requirements the same for both FPGAs?
Both devices require the Cyclone V E standard power rails, typically including VCCINT (1.1 V), VCCAUX (2.5 V), and various I/O bank voltages (1.2 V to 3.3 V). However, actual current consumption and decoupling requirements differ based on logic utilization, clock frequencies, and I/O standards. Designers must refer to the respective device datasheets and power play early power estimators for exact requirements.