10M40DCF672C8G
Informations
- Lifecycle
- Active
- Stock
- 5081 PCS
- Package
- BGA-672
- Series
- FPGA embarqué (Field Programmable Gate Array)
Cette comparaison détaillée des composants 10M40DCF672C8G et 10M40DCF484C7G vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The 10M40DCF484C7G is a viable functional replacement candidate for the 10M40DCF672C8G, sharing the same Intel MAX 10 FPGA family, 40,000 logic elements, and core architecture, but requiring careful validation of package footprint, I/O pinout, and speed grade before committing to a design migration.
Informations
Informations
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF672C8G | 10M40DCF484C7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 FPGA | MAX 10 FPGA | Both parts belong to the same device family, so they share the same architecture and toolchain support. |
| Logic Elements (LEs) | 40000 | 40000 | Identical logic capacity means equivalent programmable logic resources for the same design. |
| Total RAM Bits | 1269760 | 1269760 | Matching embedded memory allows the same buffering and storage requirements to be met. |
| Number of I/Os | 500 | 360 | Different I/O counts affect how many peripherals and interfaces can be connected without external expansion. |
| Package / Case | 672-BGA | 484-BGA | Package footprint and ball count differ, so PCB layout and assembly are not drop-in compatible. |
| Operating Temperature | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade must match the target environment for reliable operation. |
| Speed Grade | 8 | 7 | A faster speed grade can improve timing closure but may increase power and cost. |
| Supply Voltage | 1.2 V core | 1.2 V core | Same core voltage simplifies power supply design and compatibility. |
| Configuration Memory | Internal configuration flash | Internal configuration flash | Both devices support instant-on configuration without external configuration memory. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF672C8G | 10M40DCF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 500 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The primary differences are the package type, pin count, and speed grade. The 10M40DCF672C8G uses a 672-pin FineLine BGA package and is specified with a speed grade of 8. The 10M40DCF484C7G uses a 484-pin FineLine BGA package and is specified with a speed grade of 7. Both devices are Intel (Altera) MAX 10 field-programmable gate arrays with 40,000 logic elements and dual configuration flash memory.
Yes. Both devices belong to the same MAX 10 10M40D family and share the same core architecture, 40,000 logic elements, and dual configuration flash memory. The differences are limited to the package footprint, pin count, and speed grade. The 10M40DCF672C8G is a 672-pin FineLine BGA device with speed grade 8, while the 10M40DCF484C7G is a 484-pin FineLine BGA device with speed grade 7.
No. The two devices have different package types and pin counts, so they are not pin-compatible. The 10M40DCF672C8G requires a 672-pin FineLine BGA footprint, while the 10M40DCF484C7G requires a 484-pin FineLine BGA footprint. A board redesign or package adapter would be required, and the speed grade difference must also be validated against timing requirements.
The 10M40DCF672C8G has a speed grade of 8, and the 10M40DCF484C7G has a speed grade of 7. In Intel MAX 10 nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10M40DCF484C7G is the faster of the two, while the 10M40DCF672C8G is the slower speed grade.
Yes. Both the 10M40DCF672C8G and 10M40DCF484C7G are MAX 10 10M40D devices with dual configuration flash memory. This feature allows the devices to store two configuration images and supports features such as instant-on operation and fail-safe configuration updates.
The 10M40DCF672C8G is the better choice when more user I/O pins are required, because its 672-pin FineLine BGA package provides a higher pin count than the 484-pin FineLine BGA package of the 10M40DCF484C7G. The exact number of usable user I/O pins depends on the specific device configuration and should be confirmed in the Intel MAX 10 device pin-out documentation.
Both the 10M40DCF672C8G and 10M40DCF484C7G are offered in lead-free package options and are RoHS compliant according to Intel MAX 10 ordering information. The "G" suffix in both part numbers indicates a lead-free package. Designers should verify the specific ordering code and environmental status with the manufacturer or authorized distributor before finalizing a bill of materials.
Before migrating from the 10M40DCF484C7G to the 10M40DCF672C8G, verify the PCB footprint and land pattern for the 672-pin FineLine BGA package, confirm pin assignment and I/O availability, re-run static timing analysis because the speed grade changes from 7 to 8, and validate power delivery and thermal performance for the larger package. All changes should be checked against the official Intel MAX 10 datasheet and pin-out files.