10M40DCF256A7G
Informations
- Lifecycle
- Active
- Stock
- 5210 PCS
- Package
- LBGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Cette comparaison détaillée des composants 10M40DCF256A7G et 10M40DCF256I6G vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The 10M40DCF256A7G and 10M40DCF256I6G are functionally compatible FPGA devices sharing identical logic density, package, and I/O configuration, with the primary distinction being the operating temperature grade. The 10M40DCF256I6G offers a wider industrial temperature range and faster speed grade, making it suitable for more demanding environments, while the 10M40DCF256A7G targets automotive applications with AEC-Q100 qualification. Both devices are viable substitutes when the target application's temperature and qualification requirements are carefully matched to the appropriate grade.
Informations
Informations
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF256A7G | 10M40DCF256I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial parts support harsher conditions. |
| Speed Grade | 7 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable clock rates. |
| Logic Elements (LEs) | 40000 | 40000 | Defines the available programmable logic capacity for implementing user designs. |
| Package | 256-pin FBGA | 256-pin FBGA | Determines the physical footprint, pin count, and PCB layout compatibility. |
| Embedded Memory | 1080 kbit | 1080 kbit | On-chip memory capacity affects the ability to store data, buffers, and configuration information without external memory. |
| Number of PLLs | 4 | 4 | PLLs provide clock synthesis and management, impacting timing flexibility and clock domain support. |
| Maximum User I/O Pins | 178 | 178 | Determines how many external signals and peripherals can be interfaced directly. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must match the board power design for correct operation and power consumption. |
| Configuration Memory Type | SRAM-based | SRAM-based | SRAM-based FPGAs require external configuration memory at power-up, affecting system boot design. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF256A7G | 10M40DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TJ) | -40°C ~ 100°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the same 256-ball FineLine BGA (FBGA) package. The 10M40DCF256A7G is specified for commercial temperature operation, while the 10M40DCF256I6G is specified for industrial temperature operation. Both are dual-configuration (CF) devices with 40,000 logic elements (LEs) and integrated analog-to-digital converter (ADC) blocks.
The primary difference is the temperature grade and speed grade. The 10M40DCF256A7G is a commercial-grade device with a speed grade of 7, while the 10M40DCF256I6G is an industrial-grade device with a speed grade of 6. The industrial version supports a wider operating temperature range, making it suitable for harsher environments, whereas the commercial version is intended for standard office or consumer environments.
Yes, both devices use the same 256-ball FBGA package with identical pinouts. This means they are pin-to-pin compatible, allowing a single PCB design to accommodate either device. However, the industrial-grade 10M40DCF256I6G may have different timing characteristics due to its speed grade, so timing analysis must be re-validated if substituting.
Substitution is possible only after verifying that the industrial temperature range and the different speed grade (6 vs. 7) meet the design's timing and environmental requirements. The 10M40DCF256I6G operates over a wider temperature range but may have slower maximum operating frequencies. Always consult the Intel MAX 10 device datasheet and perform timing analysis before substituting.
The 10M40DCF256A7G (commercial grade) typically operates from 0°C to 85°C junction temperature (TJ). The 10M40DCF256I6G (industrial grade) typically operates from -40°C to 100°C junction temperature (TJ). These ranges are defined in the Intel MAX 10 device datasheet and must be respected for reliable operation.
Yes, both the 10M40DCF256A7G and 10M40DCF256I6G are dual-configuration (CF) MAX 10 devices, meaning they support both instant-on configuration from internal flash and user flash memory. They also include integrated 12-bit analog-to-digital converter (ADC) blocks, as per the MAX 10 FPGA family features.
The 10M40DCF256A7G (commercial) is typically used in consumer electronics, office equipment, and benign indoor environments. The 10M40DCF256I6G (industrial) is used in industrial automation, automotive infotainment, outdoor equipment, and other applications requiring operation over extended temperature ranges.
Verified technical data is available from the official Intel (Altera) MAX 10 FPGA device datasheet, as well as from authorized distributors such as DigiKey, Mouser, TTI, and Future Electronics. Always refer to the manufacturer's datasheet for the most accurate and up-to-date specifications.