10M40DAF256C8G
Informations
- Lifecycle
- Active
- Stock
- 5091 PCS
- Package
- LBGA-256
- Series
- FPGA embarqué (Field Programmable Gate Array)
Cette comparaison détaillée des composants 10M40DAF256C8G et 10M40DCF256C7G vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The 10M40DAF256C8G and 10M40DCF256C7G are both Intel MAX 10 FPGA devices in the same 256-ball FBGA package with identical logic density and feature set, making them strong functional replacement candidates. The primary distinction is speed grade and temperature range, so the 10M40DCF256C7G can substitute for the 10M40DAF256C8G in most designs provided the faster speed grade and commercial temperature rating are acceptable for the target application.
Informations
Informations
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DAF256C8G | 10M40DCF256C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, so they share the same architecture and toolchain support. |
| Logic Elements (LEs) | 40,000 | 40,000 | Matching logic density means both parts can implement equivalent logic designs without resource constraints. |
| Embedded Memory | 1,260 Kbit | 1,260 Kbit | Identical on-chip memory capacity supports the same buffering, FIFO, and data storage requirements. |
| Package / Pin Count | 256-pin FBGA | 256-pin FBGA | Same package and pin count allow a common PCB footprint and drop-in board compatibility. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | 0°C to +85°C (Commercial) | Equivalent temperature grades ensure both parts suit the same ambient and thermal environments. |
| Speed Grade | 8 (Fastest) | 7 (Faster) | Different speed grades affect maximum clock frequency and timing closure, so timing-critical designs may need re-verification when substituting. |
| Core Supply Voltage | 1.2 V | 1.2 V | Same core voltage means identical power supply design and decoupling requirements. |
| Configuration Flash Memory | Integrated (Single-chip) | Integrated (Single-chip) | Both are single-chip devices with on-die configuration flash, simplifying board design and enabling instant-on operation. |
| Analog-to-Digital Converter (ADC) | Yes (12-bit, 1 Msps) | Yes (12-bit, 1 Msps) | Both include the same integrated ADC block, supporting identical analog monitoring and sensing applications. |
| RoHS / Lead-Free | RoHS Compliant | RoHS Compliant | Both meet the same environmental compliance requirements for global product distribution. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256C8G | 10M40DCF256C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
The primary differences are the speed grade and the operating temperature range. The 10M40DAF256C8G is specified with a speed grade of 8 and an extended commercial temperature range of 0°C to 85°C (junction). The 10M40DCF256C7G is specified with a faster speed grade of 7 and an industrial temperature range of -40°C to 100°C (junction). Both devices are members of the Intel (formerly Altera) MAX 10 family, feature 40,000 logic elements, and are housed in a 256-pin FineLine BGA (FBGA) package.
Yes. Both devices share the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by the MAX 10 device family. This allows for a common PCB footprint. However, designers must verify that the different speed grades and temperature ranges meet the timing and environmental requirements of the target application before substituting one for the other.
Not necessarily. While the package and pinout are identical, the 10M40DCF256C7G has a faster speed grade (7 vs. 8) and a wider industrial temperature range (-40°C to 100°C vs. 0°C to 85°C). A direct replacement would require re-validating the design's timing closure at the slower speed grade and confirming that the commercial temperature range is sufficient for the application. Conversely, replacing the C8G with the C7G may require checking for timing violations due to the faster speed grade.
Both the 10M40DAF256C8G and 10M40DCF256C7G feature 40,000 logic elements (LEs). They also include 1,260 Kbits of M9K embedded memory blocks and 288 Kbits of user flash memory (UFM). These parameters are consistent across the MAX 10 10M40 device density.
Yes. Both devices are part of the MAX 10 family, which features instant-on configuration from on-chip flash memory. They also integrate analog-to-digital converter (ADC) blocks. The 10M40 devices include two ADC blocks with a 12-bit resolution and up to 1 MSPS sampling rate, subject to the specific speed grade and temperature range.
The 10M40DAF256C8G is rated for commercial operation with a junction temperature (Tj) range of 0°C to 85°C. The 10M40DCF256C7G is rated for industrial operation with a junction temperature (Tj) range of -40°C to 100°C. The industrial version is suitable for harsher environments, while the commercial version is intended for controlled environments.
The 10M40DCF256C7G has a faster speed grade (7) compared to the 10M40DAF256C8G (8). A lower speed grade number indicates faster performance. When migrating a design from the C7G to the C8G, the slower speed grade may reduce the maximum operating frequency (Fmax) and could cause timing violations. Conversely, migrating from the C8G to the C7G generally provides additional timing margin. In both cases, a full timing analysis must be performed using the respective device timing models.
Yes. Both the 10M40DAF256C8G and 10M40DCF256C7G are offered in RoHS-compliant, lead-free packages. The 256-pin FineLine BGA (FBGA) package is compatible with lead-free soldering processes. Designers should refer to the manufacturer's packaging and ordering information for specific compliance documentation.