10M16DCU324C8G vs 10M16DAU324C8G

Cette comparaison détaillée des composants 10M16DCU324C8G et 10M16DAU324C8G vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10M16DCU324C8G is a viable functional replacement candidate for the 10M16DAU324C8G, with core logic density, package footprint, and speed grade aligning closely. The primary distinction lies in the integrated transceiver configuration, which requires validation against the target application's interface requirements before final substitution.

Logic Density High match
Package Type High match
Speed Grade High match
Transceiver Configuration Validation required

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10M16DAU324C8G 10M16DCU324C8G Why it matters
Family MAX 10 MAX 10 Both devices belong to the same FPGA family, ensuring similar architecture and toolchain support.
Logic Elements (LEs) 16000 16000 Identical logic capacity means equivalent design density and resource availability.
Total RAM (Kbits) 562 562 Same embedded memory allows identical buffering and data storage capabilities.
18x18 Multipliers 160 160 Equal DSP resources support the same signal processing performance.
Package 324-FBGA 324-FBGA Same package ensures physical footprint and pinout compatibility.
Operating Temperature 0°C to 85°C 0°C to 85°C Identical temperature range allows use in the same commercial environments.
Speed Grade 8 8 Speed grade affects maximum operating frequency and timing closure; both share grade 8.
Configuration Memory Type Single Compressed Image Dual Compressed Image Dual configuration image supports fail-safe updates and rollback, while single image does not.
Configuration Flash (Mbits) Not available Not available Integrated configuration flash simplifies board design; both lack it.
User Flash Memory (Kbits) Not available Not available User flash provides non-volatile storage for configuration or data; neither offers it.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10M16DCU324C8G 10M16DAU324C8G
Series MAX® 10 MAX® 10
Part Status Active Active
Digi Key Programmable Not Verified -
Number of LA Bs / CL Bs 1000 -
Number of Logic Elements / Cells 16000 -
Total RAM Bits 562176 562176
Number of I/O 246 246
Voltage - Supply 1.15V ~ 1.25V 1.15V ~ 1.25V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Packaging Tray -
Number of LABs/CLBs - 1000
Number of Logic Elements/Cells - 16000

Frequently asked questions

What is the difference between the 10M16DAU324C8G and the 10M16DCU324C8G?

The primary difference is the operating temperature grade. The 10M16DAU324C8G is specified for commercial temperature range operation, while the 10M16DCU324C8G is specified for industrial temperature range operation. Both are Intel (Altera) MAX 10 field-programmable gate array (FPGA) devices with 16,000 logic elements in a 324-pin UBGA package, speed grade 8.

Are the 10M16DAU324C8G and 10M16DCU324C8G functionally interchangeable?

Functionally, both devices provide the same MAX 10 FPGA logic density, embedded memory, DSP blocks, and analog-to-digital converter (ADC) capabilities. However, they are not interchangeable in all applications because the industrial-grade 10M16DCU324C8G supports a wider operating temperature range than the commercial-grade 10M16DAU324C8G. The correct choice depends on the target application's thermal environment.

What is the operating temperature range for each device?

The 10M16DAU324C8G is rated for the commercial temperature range, typically 0°C to 85°C junction temperature (TJ). The 10M16DCU324C8G is rated for the industrial temperature range, typically -40°C to 100°C junction temperature (TJ). Designers must verify the exact limits in the Intel MAX 10 device datasheet for the specific speed grade and package combination.

Do both devices use the same package and pinout?

Yes. Both the 10M16DAU324C8G and 10M16DCU324C8G are offered in the same 324-pin UBGA (Ultra FineLine BGA) package with identical pinouts. This means the PCB footprint and pin assignments are the same, allowing a common board design to accommodate either temperature grade.

What is the logic density and speed grade of these devices?

Both devices feature 16,000 logic elements (LEs) and are rated at speed grade 8. The "10M16" prefix indicates the MAX 10 family with 16K LEs, "D" denotes the dual-supply feature set, "A" or "C" indicates the temperature grade, "U324" specifies the 324-pin UBGA package, and "C8" indicates commercial temperature grade with speed grade 8 for the 10M16DAU324C8G. For the 10M16DCU324C8G, the "C8" suffix similarly indicates speed grade 8, with the "D" in the fourth position denoting industrial temperature grade.

Can the 10M16DCU324C8G be used as a drop-in replacement for the 10M16DAU324C8G?

In many cases, yes, because both share the same package, pinout, and logic density. However, the 10M16DCU324C8G is qualified for a wider industrial temperature range, so it may have different timing characteristics or power consumption at extreme temperatures. A drop-in replacement should be validated against the specific design's timing closure and thermal requirements using Intel's official datasheet and timing models.

Which device is more suitable for industrial applications?

The 10M16DCU324C8G is more suitable for industrial applications because its industrial temperature grade supports operation from -40°C to 100°C junction temperature. The 10M16DAU324C8G, with its commercial temperature range, is better suited for consumer or office-grade environments where temperatures remain within 0°C to 85°C.

Are there any differences in power consumption between the two devices?

Power consumption for both devices depends on the specific design, clock frequencies, and resource utilization. Intel provides power estimation tools and datasheets that list static and dynamic power characteristics. Because the industrial-grade 10M16DCU324C8G is characterized over a wider temperature range, its worst-case power numbers may differ from the commercial-grade 10M16DAU324C8G. Always consult the latest Intel MAX 10 power play early power estimator (PPE) or datasheet for verified values.

What configuration options are available for these MAX 10 devices?

Both the 10M16DAU324C8G and 10M16DCU324C8G support the same MAX 10 configuration features, including internal configuration flash, dual configuration images, and instant-on capability. They also support external configuration via JTAG and other standard interfaces. Detailed configuration schemes are documented in the Intel MAX 10 FPGA configuration user guide.