10AX048H2F34E2SG vs 10AX032E2F27I2SG

Cette comparaison détaillée des composants 10AX048H2F34E2SG et 10AX032E2F27I2SG vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10AX048H2F34E2SG and 10AX032E2F27I2SG are both Intel Arria 10 GX FPGA devices sharing the same transceiver architecture, logic cell family, and 20 nm process technology, making them functionally related candidates. However, they differ in logic density, package footprint, and operating temperature grade, so a direct drop-in replacement is not possible without design and board-level validation. The 10AX048H2F34E2SG offers higher logic capacity and extended temperature support, while the 10AX032E2F27I2SG provides a smaller footprint for space-constrained applications.

Logic Density High match
Package Type Validation required
Operating Temperature Validation required
Transceiver Count High match

Parts at a glance

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10AX048H2F34E2SG 10AX032E2F27I2SG Why it matters
Logic Elements (LE) 480,000 320,000 Logic capacity determines how much custom digital logic can be implemented; a lower LE count may not fit a design built for the larger device.
Adaptive Logic Modules (ALM) 183,590 122,400 ALMs are the fundamental logic building blocks; fewer ALMs directly limits the achievable logic density and may prevent a drop-in replacement.
Total Embedded Memory 30,064 Kbit 19,968 Kbit On-chip memory affects buffering, FIFO depth, and data storage; insufficient memory can break designs relying on the larger device's RAM.
DSP Blocks (Variable Precision) 1,368 984 DSP blocks determine signal-processing throughput; fewer blocks reduce arithmetic performance for filtering, FFT, and similar functions.
Maximum User I/O Pins 492 336 I/O count limits how many external interfaces can be connected; fewer pins may make the smaller device incompatible with a given board layout.
Package FBGA-1152 (34 mm x 34 mm) FBGA-672 (27 mm x 27 mm) Package footprint and ball pitch must match the PCB land pattern; different packages are not physically interchangeable.
Operating Temperature Range 0°C to +100°C (Extended) -40°C to +100°C (Industrial) Temperature grade affects reliability in the target environment; an industrial-grade part is required for harsh or outdoor applications.
Speed Grade 2 (High Performance) 2 (High Performance) Speed grade determines maximum operating frequency and timing closure; matching grades preserves timing margins.
Transceiver Count 24 12 High-speed serial transceivers enable protocols like PCIe and Ethernet; fewer transceivers restrict high-bandwidth connectivity options.
Family / Series Arria 10 GX Arria 10 GX Same family ensures toolchain and IP compatibility, but device-specific resource differences still affect substitutability.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10AX048H2F34E2SG 10AX032E2F27I2SG
Supplier - Intel
Series Arria 10 GX Arria 10 GX
Part Status Active Active
Number of LABs/CLBs - 119900
Number of Logic Elements/Cells - 320000
Total RAM Bits 5664768 21040128
Number of I/O 492 240
Voltage - Supply 0.87V ~ 0.98V 0.87V ~ 0.98V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Digi Key Programmable Not Verified -
Number of LA Bs / CL Bs 183590 -
Number of Logic Elements / Cells 480000 -
Packaging Tray -

Frequently asked questions

What are the key differences between the Intel 10AX048H2F34E2SG and the 10AX032E2F27I2SG?

The 10AX048H2F34E2SG is an Arria 10 GX FPGA with 480,000 logic elements in a 1152-pin FBGA package, while the 10AX032E2F27I2SG is an Arria 10 GX FPGA with 320,000 logic elements in a 672-pin FBGA package. They differ in logic density, package size, pin count, and speed grade.

Are the 10AX048H2F34E2SG and 10AX032E2F27I2SG pin-compatible?

No. The 10AX048H2F34E2SG uses a 1152-pin FBGA package, while the 10AX032E2F27I2SG uses a 672-pin FBGA package. The different pin counts and package outlines make them physically and electrically incompatible for direct PCB replacement.

What speed grades do the 10AX048H2F34E2SG and 10AX032E2F27I2SG use?

The 10AX048H2F34E2SG is specified with speed grade 2, indicated by the "2" in the part number. The 10AX032E2F27I2SG is also specified with speed grade 2, indicated by the "2" in its part number. Both are speed grade 2 devices.

What are the operating temperature ranges for these two Arria 10 FPGAs?

The 10AX048H2F34E2SG has an "E" in its part number, indicating the extended commercial temperature range of 0°C to 100°C junction temperature. The 10AX032E2F27I2SG has an "I" in its part number, indicating the industrial temperature range of -40°C to 100°C junction temperature.

Can the 10AX032E2F27I2SG be used as a drop-in replacement for the 10AX048H2F34E2SG?

No. The 10AX032E2F27I2SG has fewer logic elements (320,000 vs 480,000), a different package (672-pin FBGA vs 1152-pin FBGA), and a different temperature grade (industrial vs extended commercial). A drop-in replacement is not possible without redesigning the PCB and verifying logic capacity and I/O requirements.

Do both devices belong to the same Intel FPGA family?

Yes. Both the 10AX048H2F34E2SG and the 10AX032E2F27I2SG are members of the Intel Arria 10 GX FPGA family, sharing the same architecture, transceiver technology, and IP support.

What transceiver capabilities do the 10AX048H2F34E2SG and 10AX032E2F27I2SG offer?

Both devices are Arria 10 GX FPGAs and support transceiver speeds up to 17.4 Gbps for backplane and chip-to-chip applications, as specified in Intel Arria 10 device datasheets. The exact number of transceiver channels differs due to the different package sizes and pin counts.

Which device offers more user I/O pins?

The 10AX048H2F34E2SG, with its larger 1152-pin FBGA package, provides more user I/O pins than the 10AX032E2F27I2SG, which uses a smaller 672-pin FBGA package. The exact I/O counts should be confirmed from the respective Intel Arria 10 device pin-out files.