Part A
10AX048H2F34E2SG
Altra
- Lifecycle
- Active
- Stock
- 4660 PCS
- Series
- FPGA embarqué (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10AX048H2F34E2SG and 10AX032E2F27E1SG are both Intel Arria 10 GX FPGAs sharing the same core architecture, transceiver technology, and logic cell family, making them functionally related candidates. However, they differ in logic density, package footprint, and speed grade, so the 10AX032E2F27E1SG cannot serve as a direct drop-in replacement for the 10AX048H2F34E2SG without design validation. The 10AX048H2F34E2SG offers higher logic capacity and a larger package, while the 10AX032E2F27E1SG provides a smaller footprint with lower density. Verification of pinout, thermal, and power delivery requirements is required before substitution.
Logic Density
Validation required
Package Type
Validation required
Transceiver Capability
High match
Speed Grade
Validation required
Parts at a glance
Part B
10AX032E2F27E1SG
Informations
- Lifecycle
- Active
- Stock
- 6764 PCS
- Package
- BBGA-672
- Series
- FPGA embarqué (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048H2F34E2SG | 10AX032E2F27E1SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines how much digital logic can be implemented; a lower LE count may not fit the same design. |
| Adaptive Logic Modules (ALM) | 183,590 | 122,400 | ALMs are the fundamental logic building blocks; fewer ALMs limit achievable design complexity. |
| Total RAM (Mbits) | 28.3 | 18.9 | On-chip memory affects buffering, FIFO depth, and data storage capability within the FPGA. |
| DSP Blocks (18x19 MAC) | 1,368 | 912 | DSP blocks determine signal processing throughput for multiply-accumulate intensive applications. |
| Package | FBGA-1152 | FBGA-672 | Package footprint and ball count affect PCB layout, routing resources, and mechanical compatibility. |
| Transceiver Count | 24 | 12 | High-speed transceivers enable serial interfaces such as PCIe, Ethernet, and Interlaken; fewer channels restrict I/O bandwidth. |
| Maximum Transceiver Data Rate | 17.4 Gbps | 12.5 Gbps | Higher per-lane data rate supports faster serial protocols and reduces lane count requirements. |
| Speed Grade | 2 (High Performance) | 2 (High Performance) | Speed grade affects maximum operating frequency and timing closure; matching grades preserves performance targets. |
| Operating Temperature Range | 0°C to 100°C (Commercial) | 0°C to 100°C (Commercial) | Temperature grade must match the target environment for reliable operation and thermal design. |
| Supply Voltage (Core) | 0.9 V | 0.9 V | Core voltage compatibility ensures the same power delivery design can be reused. |
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Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048H2F34E2SG | 10AX032E2F27E1SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Discontinued at Digi-Key |
| Number of LABs/CLBs | - | 119900 |
| Number of Logic Elements/Cells | - | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 492 | 240 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 183590 | - |
| Number of Logic Elements / Cells | 480000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the Intel 10AX048H2F34E2SG and the 10AX032E2F27E1SG?
The 10AX048H2F34E2SG is an Arria 10 GX FPGA with 480,000 logic elements in a 1152-pin FBGA package, while the 10AX032E2F27E1SG is an Arria 10 GX FPGA with 320,000 logic elements in a 672-pin FBGA package. They differ in logic density, package size, transceiver count, and speed grade.
Are the 10AX048H2F34E2SG and 10AX032E2F27E1SG pin-compatible?
No. The 10AX048H2F34E2SG uses a 1152-pin FBGA package (F34) and the 10AX032E2F27E1SG uses a 672-pin FBGA package (F27). Different package sizes and pin counts mean they are not pin-compatible and cannot be interchanged on the same PCB footprint.
Do both devices belong to the same Intel FPGA family?
Yes. Both the 10AX048H2F34E2SG and the 10AX032E2F27E1SG are members of the Intel Arria 10 GX FPGA family, sharing the same architecture, transceiver technology, and hardened IP blocks, but with different logic densities and package options.
What is the logic element count for each device?
The 10AX048H2F34E2SG contains 480,000 logic elements, while the 10AX032E2F27E1SG contains 320,000 logic elements. The higher logic count of the 10AX048H2F34E2SG supports larger and more complex designs.
What speed grade does each part use?
The 10AX048H2F34E2SG is specified with speed grade 2, and the 10AX032E2F27E1SG is specified with speed grade 1. Speed grade 1 is faster than speed grade 2 in the Arria 10 family, affecting maximum operating frequency and timing closure.
Can the 10AX032E2F27E1SG be used as a drop-in replacement for the 10AX048H2F34E2SG?
No. The two devices differ in logic density, package footprint, pin count, and speed grade. A drop-in replacement is not possible without redesigning the PCB and revalidating the design against the target device's resources and timing.
Do both devices support the same transceiver data rates?
Both are Arria 10 GX devices and support transceiver data rates up to 17.4 Gbps per channel, but the total number of transceiver channels differs due to the different package sizes. The 10AX048H2F34E2SG in the larger F34 package provides more transceiver channels than the 10AX032E2F27E1SG in the F27 package.
Which device is better suited for high-logic-density applications?
The 10AX048H2F34E2SG is better suited for high-logic-density applications because it offers 480,000 logic elements compared to 320,000 in the 10AX032E2F27E1SG. The larger package also provides more I/O and transceiver resources for complex system designs.