10AX016E4F27E3SG
Informations
- Lifecycle
- Active
- Stock
- 2616 PCS
- Package
- FBGA-672
- Series
- FPGA embarqué (Field Programmable Gate Array)
Cette comparaison détaillée des composants 10AX016E4F27E3SG et 10AX032E2F27E2SG vous offre un aperçu précieux de leurs spécifications et caractéristiques clés. Nous abordons en détail les facteurs importants, notamment la conformité RoHS, le statut REACH, la série, le mode de montage, le type de boîtier et d'autres caractéristiques pertinentes. La présentation côte à côte des différences simplifie la sélection des composants et vous permet de choisir plus facilement la meilleure option pour votre application spécifique.
Replacement verdict
The 10AX016E4F27E3SG and 10AX032E2F27E2SG are both Intel Arria 10 GX series FPGAs sharing the same 672-pin FBGA package and core architecture, making them functionally related candidates. However, they differ in logic density, speed grade, and operating temperature range, so the 10AX032E2F27E2SG cannot be considered a direct drop-in replacement without design validation.
Informations
Informations
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX016E4F27E3SG | 10AX032E2F27E2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 160,000 | 320,000 | Logic element count determines the amount of programmable logic capacity available for implementing a design; a device with half the LEs cannot host a design that requires the larger capacity. |
| Adaptive Logic Modules (ALM) | 61,000 | 122,000 | ALMs are the fundamental logic building blocks in Intel Arria 10 devices; the count directly scales the usable logic density and affects whether a design fits. |
| Total Embedded Memory | 11,200 Kb | 22,400 Kb | On-chip memory capacity constrains buffering, FIFOs, and lookup tables; insufficient memory forces external memory usage or prevents the design from fitting. |
| 18x19 Multipliers | 312 | 624 | Dedicated multipliers determine DSP throughput for arithmetic-intensive functions such as filtering and FFT; fewer multipliers reduce achievable DSP performance. |
| Maximum User I/O | 240 | 240 | User I/O count determines how many external signals and peripherals can be interfaced directly; both devices share the same F27 package pinout. |
| Transceiver Count | 12 | 12 | High-speed serial transceivers enable protocols such as PCIe, Ethernet, and JESD204; identical counts mean equivalent high-speed interface capability. |
| Package | FBGA-672 | FBGA-672 | Package type and pin count must match for board-level drop-in compatibility; both use the same 672-ball fine-pitch BGA. |
| Speed Grade | 4 | 2 | Speed grade determines maximum operating frequency and timing closure margin; a faster grade (lower number) can meet tighter timing but may cost more. |
| Operating Temperature Range | 0°C to 100°C (E3) | 0°C to 100°C (E2) | Temperature grade defines the environmental conditions the device is qualified for; both are commercial-grade extended temperature parts. |
| Supply Voltage (Core) | 0.9 V | 0.9 V | Core voltage must match the board power design; identical 0.9 V core supply allows shared power delivery architecture. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10AX016E4F27E3SG | 10AX032E2F27E2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 61510 | 119900 |
| Number of Logic Elements/Cells | 160000 | 320000 |
| Total RAM Bits | 10086400 | 21040128 |
| Number of I/O | 240 | 240 |
| Voltage - Supply | 0.87V ~ 0.93V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
The primary differences are logic density, speed grade, and operating temperature range. The 10AX016E4F27E3SG is an Arria 10 GX FPGA with 160,000 logic elements, a speed grade of 4, and an extended temperature range (0°C to 100°C junction). The 10AX032E2F27E2SG has 320,000 logic elements, a faster speed grade of 2, and an industrial temperature range (-40°C to 100°C junction). Both use the same 672-pin FBGA package (F27).
Yes, both devices are offered in the same 672-pin FineLine BGA (FBGA) package with the F27 footprint. However, pin-to-pin compatibility does not guarantee functional equivalence; the 10AX032E2F27E2SG has more logic resources and a different speed grade, so the PCB design and power delivery must be validated against the respective datasheets.
No, a direct drop-in replacement is not recommended without design validation. The 10AX032E2F27E2SG offers twice the logic density and a faster speed grade, which affects timing closure, power consumption, and configuration bitstream. The 10AX016E4F27E3SG also has a narrower temperature range (0°C to 100°C vs. -40°C to 100°C). The system designer must verify that the lower density and slower speed grade meet all functional and timing requirements.
The 10AX016E4F27E3SG is specified for an extended temperature range with a junction temperature (Tj) of 0°C to 100°C. The 10AX032E2F27E2SG is specified for an industrial temperature range with a junction temperature (Tj) of -40°C to 100°C. These ranges are defined in the respective Intel Arria 10 device datasheets.
Both devices belong to the Intel Arria 10 GX family and support transceiver speeds up to 17.4 Gbps per channel, with protocol support for PCIe Gen3, 10/40/100 Gigabit Ethernet, and other standards. However, the exact number of transceiver channels and their maximum performance may vary by density and speed grade. Designers must consult the Arria 10 GX device pin-out and transceiver channel mapping for the specific ordering code.
The 10AX016E4F27E3SG contains 160,000 logic elements. The 10AX032E2F27E2SG contains 320,000 logic elements. These values are specified in the Intel Arria 10 GX device overview and product tables.
Yes, both the 10AX016E4F27E3SG and 10AX032E2F27E2SG are offered in RoHS-compliant, lead-free packages as standard. The "SG" suffix in the ordering code indicates lead-free (Pb-free) construction. Verification of the specific environmental compliance for a given lot should be confirmed via the manufacturer's material declaration or distributor product page.
The 10AX016E4F27E3SG is generally more cost-effective due to its lower logic density and slower speed grade. It is suitable for applications that do not require the higher logic count or industrial temperature range of the 10AX032E2F27E2SG. However, final selection depends on the specific design's logic utilization, timing requirements, and operating environment.